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Display backplane and display device

A display backplane and display area technology, applied in the direction of electric solid devices, semiconductor devices, organic semiconductor devices, etc., can solve the problem of edge peeling of the first thin film encapsulation layer, to avoid peeling, increase contact area, reduce contact area Effect

Active Publication Date: 2020-03-06
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present application expects to provide a display backplane and a display device for solving the problem of peeling off at the edge of the first thin film encapsulation layer

Method used

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  • Display backplane and display device
  • Display backplane and display device
  • Display backplane and display device

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Experimental program
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Embodiment Construction

[0024] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0025] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0026] Flexible OLEDs and flexible QLEDs are usually encapsulated by thin films. For example, flexible OLEDs can adopt, but are not limited to, the following structures, including a flexible substrate, a barrier layer formed on the flexible substrate, a gate layer formed on the barrier layer, and a...

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Abstract

The application relates to the field of display technology, and discloses a display backplane and a display device. Wherein, the display backplane includes a display area and a non-display area surrounding the display area, the non-display area is provided with at least one first cofferdam surrounding the display area, and the first cofferdam is provided with a second A thin film encapsulation layer, the non-display area is provided with a fan-out area, and a second bank is provided on the side of the first bank close to the fan-out area, and the second bank has a first bonding pattern , the first bonding pattern includes a plurality of protrusions, and the first thin film encapsulation layer at least partially covers the protrusions. The above solution avoids the problem of poor display caused by peeling between the inorganic layers of the first thin film encapsulation layer, or between the inorganic layer of the first thin film encapsulation layer and the passivation layer (substrate).

Description

technical field [0001] The present application generally relates to the field of display technology, and in particular to a display backplane and a display device. Background technique [0002] Flexible display devices, such as flexible OLED (Organic Light-Emitting Diode; organic light-emitting diode), flexible QLED (Quantum Dot Light Emitting Diodes; quantum dot light-emitting diode), are the main trends in the future development of display technology. In particular, QLED has many advantages, such as impact resistance, strong shock resistance, light weight, small size, and more convenient to carry. [0003] In a flexible display device, in order to achieve a narrow border, the flexible backplane needs to bend the fan-out area of ​​the flexible backplane, which is very easy to cause the Delamination occurs between the inorganic layer of the encapsulation layer and the passivation layer (substrate), resulting in poor display. Contents of the invention [0004] The present...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/873Y02E10/549H10K77/10H10K50/844H10K2102/00
Inventor 张玉欣
Owner BOE TECH GRP CO LTD