Fingerprint imaging module and formation method thereof, fingerprint imaging module motherboard, and electronic equipment

An imaging module and fingerprint technology, applied in circuits, electrical components, electrical solid-state devices, etc., can solve the problems of large module thickness, difficulty in improving integration, and reduce adoption, benefit cost control, and reduce module size. The effect of thickness

Inactive Publication Date: 2018-10-09
SHANGHAI OXI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the fingerprint imaging module in the prior art has the problem that the thickness of the module is relatively large, and it is difficult to improve the integration degree

Method used

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  • Fingerprint imaging module and formation method thereof, fingerprint imaging module motherboard, and electronic equipment
  • Fingerprint imaging module and formation method thereof, fingerprint imaging module motherboard, and electronic equipment
  • Fingerprint imaging module and formation method thereof, fingerprint imaging module motherboard, and electronic equipment

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Experimental program
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Embodiment Construction

[0051] It can be seen from the background art that the fingerprint imaging module in the prior art has the problem of excessive thickness of the module. Combining with the structure of a fingerprint imaging module, the reason for the excessive thickness of the module is analyzed:

[0052] The optical fingerprint imaging module mainly includes: protective cover, optical sensor, integrated chip (IC), flexible circuit board (FPC) and electronic devices on the flexible circuit board (including light source LED), light guide plate, upper protective shell and Lower protective shell and other main components. Among them, the optical sensor is made on a glass substrate using semiconductor technology such as amorphous silicon thin film transistor (a-Si TFT), low temperature polysilicon thin film transistor (LTPS TFT) or oxide semiconductor thin film transistor (OS TFT); after cutting , dispensing, bonding and other processes to achieve packaging.

[0053] refer to figure 1 , shows a...

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Abstract

The invention provides a fingerprint imaging module and a formation method thereof, a fingerprint imaging module motherboard, and electronic equipment. The fingerprint imaging module comprises a substrate comprising a first surface and a second surface arranged in an opposite manner, a light-emitting stacking layer located on the second surface of the substrate and used for generating an incidentlight, a sensing surface on which a reflected light carrying fingerprint information is formed by the incident light, and a pixel array located on the first surface of the substrate and used for acquiring the reflected light to obtain fingerprint information. According to the technical scheme, the integration of a light source and an image sensor can be realized, the thickness of the fingerprint imaging module can be effectively reduced, and the integrated level of the equipment can be improved; besides, the thickness of the fingerprint imaging module is reduced, and the adoption of a module thinning process can be reduced so that the loss of the yield during formation of the fingerprint imaging module in the thinning process can be reduced, the manufacturing yield can be increased, and the cost can be lowered.

Description

technical field [0001] The invention relates to the field of fingerprint imaging, in particular to a fingerprint imaging module and its forming method, a motherboard of the fingerprint imaging module, and electronic equipment. Background technique [0002] The fingerprint identification technology collects the fingerprint image of the human body through the fingerprint imaging module, and then compares it with the existing fingerprint imaging information in the fingerprint identification system to realize identity identification. Due to the convenience of use and the uniqueness of human fingerprints, fingerprint recognition technology has been widely used in various fields, such as: public security bureaus, customs and other security inspection fields, building access control systems, and consumer products such as personal computers and mobile phones, etc. [0003] The imaging methods of the imaging module used in the fingerprint identification technology include optical, ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L31/12H01L51/50H01L51/52H01L51/56G06K9/00
CPCH01L25/167H01L31/125G06V40/13H10K50/13H10K50/805H10K50/856H10K71/00
Inventor 曲志刚朱虹
Owner SHANGHAI OXI TECH
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