39results about How to "Reduce module thickness" patented technology

A light source module includes: a light source; a lighting curtain that partially blocks light from the light source; and a reflective layer that is provided on the lighting curtain and that has a planar shape smaller than the lighting curtain.

A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A multi-layered wiring section (2) is formed by respective unit wiring layers (8) to (12) in such a manner that an upper unit wiring layer is layered on a surface-planarized subjacent unit wiring layer and connected to one another by inter-layer connection by a via-on-via structure. A semiconductor chip (6) mounted on this multi-layer wiring section (2) is polished along with the sealing resin layer (7) for reducing the thickness.

A cooling device of a light emitting diode module and a method for fabricating the same are disclosed. According to the cooling device for a light emitting diode module of the present invention, the thickness of the whole module is reduced, a thermal resistance is small since a final heat-releasing path from a heat source is shortened, it is easy to release heat, and processing efficiency is high and manufacturing cost is low because a bending process of a lead frame is removed.

The invention relates to a lens which comprises a lens barrel, a first lens unit and a second lens unit are arranged in the lens barrel, a driving part is arranged on the first lens unit, and during zooming or focusing, the driving part shrinks or expands under the action of temperature so as to drive the first lens unit to move in the direction of an optical axis; and the second lens unit comprises a liquid lens, the liquid lens is filled with a transparent solution, and the transparent solution is heated to expand during zooming or focusing or is cooled to contract during zooming or focusingso as to regulate and control the focal power of the liquid lens. According to the lens, the use of a motor rotor and an induction coil can be avoided, and the thickness of the lens module is effectively reduced. The invention also relates to an image capturing device and electronic equipment.

An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

The invention provides a surface-capacitive touch panel and a manufacturing method thereof. The touch panel comprises a transparent substrate, a decorating layer, a capacitance sensing electrode layer, a metal routing pattern layer and a protective layer, wherein the decorating layer is formed on a surface of the transparent substrate; and the capacitance sensing electrode layer is formed on a first side of the transparent substrate. The metal routing pattern layer is formed on the capacitance sensing electrode layer, and a forming position of the decorating layer is substantially coincided with the metal routing pattern layer to cover metal routing. The protective layer is formed between the transparent substrate and the capacitance sensing electrode layer. According to the surface-capacitive touch panel and the manufacturing method thereof, the film thickness can be reduced, the film thickness uniformity is improved, and higher reliability and other efficacies can be realized.

The present invention discloses an improved inductor structure, which applies to the semiconductor field, particularly to a system-on-chip, and which comprises a substrate, a first conductive patterned film, and a first insulating layer formed between the substrate and the first conductive patterned film. The substrate has a base and an accommodation portion formed in the base. A magnetic material is filled into the accommodation portion to form a magnetic region. The accommodation portion is fabricated via etching the base or drilling a through-hole in the base. A plurality of conductive wires is arranged in a spiral way to form the first conductive patterned film. A protective layer covers the surface of the first conductive patterned film and isolates the contact of the first conductive patterned film and moisture.

The invention provides a backlight module which comprises a light source, a light guide plate and a reflector plate. The light source is located on the side face of the light guide plate. The bottom face of the light guide plate is provided with a plurality of lattice points arranged at intervals. The reflector plate is attached to the bottom face of the light guide plate and covers the multiple lattice points. The reflector plate is a mirror reflector plate with a mirror reflection function. The backlight module is good in light emitting effect, the thickness of the module can be reduced, and ultrathin complete machine design can be achieved.

A backlight module has a light guide plate, a back plate and light emitting assemblies. The light guide plate is substantially prism-like. The back plate has a shape corresponding to that of the light guide plate, and has an inclined first side plate and an inclined second side plate opposite to the first side plate. Each of the first and second side plates has at least one receiving recess, and the light emitting assemblies are received in the receiving recesses. In comparison with a side-light type backlight module, the present invention saves a heat-dissipation aluminum extrusion member. In comparison with a direct-light type backlight module, the present invention shortens the light mixing distance in a vertical direction, so as to reduce the module thickness.

The present disclosure provides a backlight module including a rubber frame, a light guiding plate disposed in the rubber frame, a light strip located on a light incident side of the light guiding plate, an optical film set disposed on a surface of a side of the light guiding plate, and a reflecting sheet disposed on a surface of a side of the light guiding plate deviating from the optical film set. The reflecting sheet is fixed on the rubber frame by a double-faced adhesive, the light strip includes a light strip circuit board, a heat-radiating sheet is disposed on a surface of a side of the light strip circuit board deviating from the light guiding plate, and the heat-radiating sheet includes a fitting portion attached onto the light strip circuit board and a bendable first extension portion extending to an outside of the rubber frame.

A modular conveyor belt formed of rows of belt modules pivotally interlinked by transverse pivot rods. The modules include a top, product conveying surface and a bottom, sprocket-driven surface. The belt modules have a plurality of first link ends disposed in the direction of travel of the conveyor belt and a plurality of second link ends disposed in the opposite direction. Transverse holes in the link ends are aligned to accommodate a pivot rod. When the link ends of the consecutive rows of side by side modules are intercalated, the pivot rod serves as a hinge pin in a hinged joint between consecutive interlinked rows. The transverse holes are disposed at an angle relative to the top surface of the belt module such that when the belt modules are connected to form a belt the transverse holes in adjacent link ends are disposed at opposite angles.

The invention provides a fingerprint imaging module and a formation method thereof, a fingerprint imaging module motherboard, and electronic equipment. The fingerprint imaging module comprises a substrate comprising a first surface and a second surface arranged in an opposite manner, a light-emitting stacking layer located on the second surface of the substrate and used for generating an incidentlight, a sensing surface on which a reflected light carrying fingerprint information is formed by the incident light, and a pixel array located on the first surface of the substrate and used for acquiring the reflected light to obtain fingerprint information. According to the technical scheme, the integration of a light source and an image sensor can be realized, the thickness of the fingerprint imaging module can be effectively reduced, and the integrated level of the equipment can be improved; besides, the thickness of the fingerprint imaging module is reduced, and the adoption of a module thinning process can be reduced so that the loss of the yield during formation of the fingerprint imaging module in the thinning process can be reduced, the manufacturing yield can be increased, and the cost can be lowered.

The invention provides an image sensor. The image sensor comprises a pixel layer and a micro-lens layer, wherein a light filter film is arranged on the surface of the micro-lens layer. The invention further provides a manufacturing method of the image sensor. The manufacturing method of the image sensor comprises the steps of 1, providing the pixel layer, wherein the pixel layer comprises a semiconductor substrate layer, a photosensitive layer arranged on the semiconductor substrate layer and a color filter layer arranged on the photosensitive layer; and 2, forming the micro-lens layer and thelight filter film on the color filter layer. The invention further provides a camera module. The camera module comprises the image sensor, a circuit board, a lens group and a carrier. The invention further provides a manufacturing method of the camera module. The manufacturing method of the camera module comprises the steps of providing the circuit board and the image sensor; fixing the image sensor to the circuit board; providing the lens group and the carrier; screwing the lens group into the carrier; and fixing the carrier fixedly provided with the lens group to the circuit board providedwith the image sensor. A light filter can be removed, so that the thickness of the module is reduced, and the production efficiency is improved.