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Device using diamond wire cutting

A technology of diamond wire cutting and equipment, applied in the field of machinery to achieve the effect of ensuring purity

Inactive Publication Date: 2018-10-12
林晓丽
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to solve the above-mentioned problems in the existing technology, and propose a device using diamond wire cutting. Damage to the surface of silicon ingots reduces costs

Method used

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Embodiment Construction

[0029] The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.

[0030] Such as figure 1 , figure 2 , image 3 with Figure 4 As shown, a kind of equipment that utilizes diamond wire cutting includes a frame 11, and a lifting frame 1a is arranged on the frame 11. It is characterized in that, the lifting frame 1a is connected with a lifting mechanism that can drive it up and down, and the lifting frame 1a A workbench 1b for placing silicon ingots is provided, and the workbench 1b is connected with a moving mechanism that can move it back and forth; one side of the workbench 1b is provided with a reel-2, and the other side of the workbench 1b is provided with a reel-2. Reel 2 3, reel 1 2 and reel 2 3 are arranged on the frame 11 in a manner of circumferential rotation and axial fixati...

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Abstract

The invention provides a device using diamond wire cutting, and belongs to the technical field of machines. The technical problem that an existing wire using diamond wire cutting carries out cutting,high temperature is generated, a diamond wire is broken, and the surface of a silicon ingot is damaged is solved. The device using diamond wire cutting comprises a rack, a lifting frame is arranged onthe rack, the device is characterized in that the lifting frame is connected with a lifting mechanism capable of driving the lifting frame to lift up and down, the lifting frame is provided with a worktable used for containing the silicon ingot, the worktable is connected with a moving mechanism capable of driving the worktable to move back and forth, a first winding cylinder is arranged on one side of the worktable, a second winding cylinder is arranged on the other side of the worktable, the first winding cylinder and the second winding cylinder are arranged on the rack in a circumferentialrotation and axial fixing manner, and the axis direction and the gravity direction of the first winding cylinder and the second winding cylinder are perpendicular. The device can effectively preventdiamond wire breakage due to too high cutting temperature of the diamond wire, the damage to the silicone ingot surface is reduced, and cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of machinery, in particular to equipment utilizing diamond wire cutting. Background technique [0002] As the third-generation semiconductor material, silicon carbide has the advantages of large band gap and high thermal conductivity. Among them, it is very important to cut the bulk single crystal into wafers with small warpage, uniform thickness and small knife slit loss. The grinding and polishing work brings great difficulties. However, since the Mohs hardness of silicon carbide is 9.2, which is second only to diamond, it is extremely difficult to process, so diamond wire cutting technology must be used for cutting. [0003] At present, the existing diamond wire cutting equipment, such as the Chinese patent discloses a diamond wire saw cutting method and cutting equipment, application number: 201310242124.6; authorization announcement number: CN 103302754 A; the diamond wire saw cutting method of the inv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B28D5/04
CPCB28D5/0058B28D5/0064B28D5/007B28D5/0076B28D5/0082B28D5/045
Inventor 郭崎峰
Owner 林晓丽
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