Bi-component solvent-free reactive polyurethane hot melt adhesive applied in electronics and household appliance industry and using method thereof

A polyurethane hot-melt adhesive, two-component technology, used in polyurea/polyurethane adhesives, adhesive types, adhesives, etc., can solve the problem of long PUR curing time, low Young's modulus, slow bonding strength, etc. problems, to ensure the quality of bonding, increase high temperature resistance, improve efficiency

Inactive Publication Date: 2018-10-16
广东中粘新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional PUR used in the electronic home appliance industry is usually a one-component reactive polyurethane hot melt adhesive. Due to the influence of the joint design and the water vapor content in the environment, the curing time of PUR is relatively long, the bond strength rises slowly, and the Young's modulus lower, poor heat resistance

Method used

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  • Bi-component solvent-free reactive polyurethane hot melt adhesive applied in electronics and household appliance industry and using method thereof
  • Bi-component solvent-free reactive polyurethane hot melt adhesive applied in electronics and household appliance industry and using method thereof
  • Bi-component solvent-free reactive polyurethane hot melt adhesive applied in electronics and household appliance industry and using method thereof

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Embodiment 1

[0031] A two-component solvent-free reactive polyurethane hot melt adhesive described in Example 1 of the present invention, which is applied to the electronic home appliance industry, includes component A and component B:

[0032] ——The component A includes a prepolymer with isocyanate groups in the side chain, an auxiliary agent, and a first catalyst; wherein the prepolymer has a functionality greater than or equal to 1, and its isocyanate content is 20%;

[0033] The prepolymer in the described component A is polyisocyanate and polyhydroxy compound b polymerization generation, wherein polyisocyanate is isophorone diisocyanate (IPDI) and diphenylmethane diisocyanate (MDI) in proportion (IPDI: MDI=0.6), and accounts for 60% of the total mass of component A; the polyhydroxy compound b is polyether polyol, selected Risheng Chemical Co., Ltd. P-2707 polyester polyol hydroxyl value range It is 150-180 mgKOH / g, and its molecular weight is 700 Daltons; wherein the polyhydroxy compo...

Embodiment 2

[0048] The present invention described in Embodiment 2 of the present invention also relates to a method for using a two-component solvent-free reactive polyurethane hot melt adhesive for the plastic film industry, including the following steps:

[0049] (1) Before use, component A and component B are packaged in independent aluminum foil composite film airtight containers;

[0050] (2) In the process of use, put A component and B group into the melter and heat them to 100°C to melt, and output them to the static mixing tube in proportion (100:50) through the metering pump to mix or mechanically mix the two components. Mix evenly to obtain the two-component solvent-free reactive polyurethane glue.

[0051] (3) Preheat the glue-coated substrate at 50°C.

[0052] (4) After heating the uniformly mixed polyurethane glue to 100°C, glue the surface of the substrate by spraying, roller coating, flow coating, extrusion coating, etc.

[0053] (5) Lay another substrate to be bonded wi...

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Abstract

The invention discloses a bi-component solvent-free reactive polyurethane hot melt adhesive applied in electronics and household appliance industry. A polyurethane adhesive is a bi-component reactiontype polyurethane hot melt adhesive. Components contain both hydroxyl and epoxy structure and can react with terminal NCO prepolymer to generate polyoxazolidone, so that high-temperature resistance ofthe hot melt adhesive after being solidified is improved, reaction is not limited by environment, mainly humidity, and final Young modulus can reach higher than 1000MPa.

Description

technical field [0001] The invention relates to a two-component solvent-free reactive polyurethane hot-melt adhesive and a using method thereof, in particular to a two-component solvent-free reactive polyurethane hot-melt adhesive and a using method thereof applied in the electronic home appliance industry. Background technique [0002] The traditional PUR used in the electronic home appliance industry is usually a one-component reactive polyurethane hot melt adhesive. Due to the influence of the joint design and the water vapor content in the environment, the curing time of PUR is relatively long, the bond strength rises slowly, and the Young's modulus Lower, poorer heat resistance. In this way, in the production of electronic household appliances such as electronics and automobile lamps, the efficiency and quality of the production process are seriously affected. How to improve the production efficiency and ensure the required bonding quality is the technical staff of this...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/08C09J175/06C08G18/75C08G18/76C08G18/66C08G18/65C08G18/48C08G18/42C08G18/58C08G18/10
CPCC08G18/10C08G18/42C08G18/48C08G18/755C08G18/7671C09J175/06C09J175/08C08G18/6674C08G18/6511
Inventor 黄世斌吴义强刘立华
Owner 广东中粘新材料科技有限公司
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