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Wafer processing device and method for processing semiconductor wafers

A processing device and wafer technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve problems such as effective control of processing gas and achieve improved product yield, increased film growth efficiency, and uniform The effect of degree increase

Active Publication Date: 2021-05-04
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Since the industry has not yet proposed an effective method for controlling the temperature of the above-mentioned processing gas, an improved mechanism for adjusting the processing temperature in the chemical vapor deposition process is required

Method used

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  • Wafer processing device and method for processing semiconductor wafers
  • Wafer processing device and method for processing semiconductor wafers
  • Wafer processing device and method for processing semiconductor wafers

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Embodiment Construction

[0070] The following disclosure provides many different embodiments, or examples, for implementing different features of embodiments of the invention. However, the following disclosures in this specification describe specific examples of each component and its arrangement in order to simplify the description of the invention. Of course, these specific examples are not intended to limit the embodiments of the present invention. For example, if the following disclosure in this specification describes that a first feature is formed on or above a second feature, it means that it includes the embodiment in which the above-mentioned first feature and the above-mentioned second feature are formed in direct contact , also includes an embodiment in which additional features may be formed between the above-mentioned first feature and the above-mentioned second feature, so that the above-mentioned first feature and the above-mentioned second feature may not be in direct contact. In addi...

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Abstract

Embodiments of the present invention provide a wafer processing device and a method for processing a semiconductor wafer. The above method includes providing a wafer processing device. The wafer processing device includes a cavity and a base set in the cavity. The submount is used to support the semiconductor wafer. The above method also includes heating a preheating element located radially outward of the abutment. The above-mentioned preheating assembly includes a plurality of flow channels defined by two adjacent convex rib structures. The method further includes providing a processing gas to the semiconductor wafer through the channel.

Description

technical field [0001] Embodiments of the present invention relate to semiconductor element production equipment and a processing method thereof, and in particular to semiconductor wafer production equipment and a semiconductor wafer processing method. Background technique [0002] Semiconductor devices are used in various electronic applications such as personal computers, cell phones, digital cameras, and other electronic equipment, for example. The manufacture of semiconductor devices is usually by sequentially depositing insulating or dielectric layer materials, conductive layer materials and semiconductor layer materials on a semiconductor substrate, and then patterning the various material layers formed by lithography to form circuit components and parts on the semiconductor substrate. [0003] In the semiconductor industry, the minimum feature size is continuously reduced, which allows more devices to be packed in a specific area, thereby continuously improving the i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67011H01L21/67103H01L2221/67
Inventor 林剑锋杨怀德张世杰张家睿林礽豪
Owner TAIWAN SEMICON MFG CO LTD