Marking position correcting device and method
A technology of marking position and correcting device, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve problems such as changes in the irradiation position, and achieve the effect of accurate correction and accurate marking of the position.
Active Publication Date: 2018-10-23
TECHNICS
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Problems solved by technology
However, even if the position of the wafer is accurately recognized and the laser beam is irradiated accurately at the initial marking operation, the irradiation position of the laser beam will change due to disturbance (vibration, heat) over time
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[0038] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily implement. However, the present invention can be realized in various forms, and is not limited to the embodiments described here. In addition, in order to clearly describe the present invention, parts irrelevant to the description are omitted in the drawings, and similar symbols are assigned to similar parts throughout the specification.
[0039] Throughout the specification, when it is stated that a certain part is "connected" to other parts, it includes not only the case of "direct connection", but also the case of "electrical connection" between a certain part and other parts through other components . In addition, when it is stated that a certain component "includes" a certain component, unless there is a specific contrary statement, it means that other components may b...
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The present invention relates to a marking position correcting device and a marking position correcting method wherein, before semiconductor chips provided on a wafer are subjected to a marking process, marked positions are measured and corrected using a screen formed on a surface of a transparent substrate such that markings can be made in correct positions on the semiconductor chip. In addition,the position in which a laser beam is detected and the position of a marking point formed on the screen by the laser beam may differ from each other due to the refractive index of the transparent substrate, but the refractive index of the transparent substrate is compensated for, according to the present invention, when calculating the position of the marking point, thereby making the correctionof the marking position accurate. A marking position correcting device according to an embodiment of the present invention is a marking position correcting device for correcting the marking position on a wafer, comprising: a position correcting member comprising a transparent substrate and a screen provided on the transparent screen; a laser head for emitting a laser beam to the screen and forminga marking point; a vision camera for acquiring information regarding the position of a detection point formed as the laser beam passes through the screen and the transparent substrate; a calculationunit for calculating information regarding the position of the marking point using the information regarding the position of the detection point acquired by the vision camera; and a control unit for comparing and matching the information regarding the position of the marking point and information regarding the marking position set on the laser head.
Description
technical field [0001] The present invention discloses a marking position correction device and method for correcting the marking position of a wafer, and discloses a method for correcting the marking position by irradiating a laser beam on a screen formed on one side of a transparent substrate before processing the wafer devices and methods. Background technique [0002] In the process of semiconductor devices, many chips are formed on a wafer. In order to distinguish the chips according to the production lot (lot), text and / or numbers are marked on the surface of each chip. A laser marking device using a laser beam is used for this purpose. Previously, each chip was marked with a lot number after dicing, but with the development of cutting-edge technology, it is possible to achieve ultra-miniaturization and weight reduction of integrated circuits (ICs), so in order to improve work efficiency To achieve mass production, it is necessary to mark individual chips on the waf...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L23/544H01L21/268H01L21/66H01L21/67H01L21/68
CPCH01L21/268H01L21/67H01L21/68H01L23/544
Inventor 崔相喆崔榮埈金秀永
Owner TECHNICS