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Conductive terminal, manufacturing method thereof, binding method, and circuit board binding method

A technology for conductive terminals and manufacturing methods, which is applied in the direction of assembling printed circuits of electric components, printed circuits, and printed circuit manufacturing. problem, to achieve the effect of simple process, easy welding and preventing short circuit

Active Publication Date: 2020-07-24
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the current binding process, there are two defects: (1) the free movement of the conductive particles 200 may lead to poor conduction of the upper and lower terminals 300 or short circuit of the left and right terminals 300; The effective connection area on the terminals in the display area is reduced, which is not suitable for the future development trend of the display industry
(3) The existing ACF 100 has poor corrosion resistance and is easily corroded by water and oxygen

Method used

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  • Conductive terminal, manufacturing method thereof, binding method, and circuit board binding method
  • Conductive terminal, manufacturing method thereof, binding method, and circuit board binding method
  • Conductive terminal, manufacturing method thereof, binding method, and circuit board binding method

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Embodiment 1

[0041] figure 2 A flow chart showing a method for manufacturing a conductive terminal according to an embodiment of the invention, the method includes steps 1 to 3:

[0042] Specifically, step one: refer to Figure 3A , forming a conductive layer 20 on the substrate 10 .

[0043] Further, the substrate 10 in this embodiment may be a base substrate in a display panel, the substrate 10 is provided with metal terminals, and the conductive layer 20 covers and contacts the metal terminals. Further, the conductive layer 20 is preferably deposited on the substrate 10 by using a magnetron sputtering process, and of course other physical vapor deposition methods can be used to form the conductive layer 20 . As a preferred embodiment, the conductive layer 20 includes a first titanium layer 20a, an aluminum layer 20b and a second titanium layer 20c stacked in sequence.

[0044] Step 2: Refer to Figure 3B , forming the solder layer 30 on the conductive layer 20 .

[0045] As a pref...

Embodiment 2

[0054] Such as Figure 4DAs shown, the conductive terminal 40 according to this embodiment includes a conductive layer 20 and a solder layer 30 disposed on the conductive layer 20 . As a preferred embodiment, the conductive terminal 40 is manufactured by the manufacturing method of the first embodiment.

Embodiment 3

[0056] Figure 5 A flowchart showing a binding method of conductive terminals according to an embodiment of the invention, the binding method includes steps S1 to S3:

[0057] Specifically, step S1: refer to Figure 6A and Figure 6B A first substrate 11 and a second substrate 12 are provided, and a first conductive terminal 41 is formed on the first substrate 11 and a second conductive terminal 42 is formed on the second substrate 12 according to the manufacturing method of the first embodiment.

[0058] Step S2: Refer to Figure 6C , align the first substrate 11 and the second substrate 12 , and make the first conductive terminals 41 and the second conductive terminals 42 adhere to each other. Specifically, a robot is used to grab the first substrate 11 and the second substrate 12, so that the first conductive terminal 41 and the second conductive terminal 42 are aligned and bonded, and then the first conductive terminal 41 and the second conductive terminal 42 are presse...

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PUM

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Abstract

The invention discloses a conductive terminal and a manufacturing method and a binding method thereof, a binding method of a circuit board and a display panel. The manufacturing method of the conductive terminal comprises the steps that a conductive layer is formed on a substrate; a brazing layer is formed on the conductive layer; and the brazing layer and the conductive layer are patterned so asto form multiple conductive terminals, wherein the conductive terminals are independent of each other. The binding method of the conductive terminal comprises the steps that the first conductive terminal and the second conductive terminal are formed on a first substrate and a second substrate respectively by using the manufacturing method; the first substrate and the second substrate are aligned and the first conductive terminal and the second conductive terminal are enabled to be fit with each other; and the first conductive terminal and the second conductive terminal are heated so that the first brazing layer of the first conductive terminal and the second brazing layer of the second conductive terminal are enabled to be fused with each other. The conductive terminals of the two sides are connected through the soldering method so as to enhance the corrosion resistance of the conductive terminals.

Description

technical field [0001] The invention belongs to the field of electronic technology, and in particular relates to a conductive terminal, a manufacturing method thereof, a binding method, a circuit board binding method, and a display device. Background technique [0002] With the continuous development of the display industry, whether it is an OLED panel or a liquid crystal panel, its pixels are gradually becoming denser, and its additional functions are increasing, so more signals need to be transmitted between different components. But for the current market, the screen-to-body ratio is gradually increasing, and the non-display area that can be used to transmit signals is gradually decreasing. Therefore, it is necessary to increase the effective binding area in the smaller and smaller non-display area. [0003] For the current binding process, it is mainly connected through anisotropic conductive film 100 (Anisotropic Conductive Film, referred to as ACF) as an intermediate s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06H05K3/34H05K1/11
CPCH05K1/11H05K3/06H05K3/3405
Inventor 包潘飞
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD