Laminate, electronic device, and production method for laminate

Abstract

The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can bekept small; which has high heat resistance; and which has high thermal conductivity. The laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.

Description

technical field

[0001] The present invention relates to a thermal expansion-controllable laminate used in electronic devices such as electronic substrates. In particular, it relates to a laminate that combines processability possessed by resins with high heat resistance at 250° C. or higher, and can conduct and transfer heat generated inside electronic equipment efficiently to release heat. Background technique

[0002] In recent years, the operating temperature of semiconductor elements for power control of electric vehicles, hybrid vehicles, and electric vehicles has increased due to the use of wide-gap semiconductors and the like. In particular, silicon carbide (SiC) semiconductors and the like attracting attention have an operating temperature of 200° C. or higher, and therefore high heat resistance of 250° C. or higher is required for the encapsulation material. Furthermore, thermal strain due to a difference in coefficient of thermal expansion between materials used i...

Images