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Heat conduction and storage composite, preparation method thereof and heat conduction, storage and dissipation device

A composite material and heat storage technology, applied in heat exchange materials, chemical instruments and methods, semiconductor devices, etc., can solve the problems of electronic products heat dissipation and cooling can not meet the heat dissipation requirements of high integration and high heat generation products, and reduce the temperature of electronic products. , to achieve the effects of excellent compressibility, reduced contact thermal resistance, and excellent heat dissipation

Inactive Publication Date: 2018-11-02
苏州矽美科导热科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The design purpose of this invention is: in order to solve the problem that traditional radiators can not meet the heat dissipation requirements of high-integration and high-calorific products, we have developed and proposed a heat-conducting and heat-storing composite material and its preparation method. It has changed the traditional way of cooling electronic products, and changed the heat dissipation method of ordinary electronic products to first store the heat of electronic products in phase change, and then conduct heat conduction, thereby reducing the temperature of electronic products

Method used

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  • Heat conduction and storage composite, preparation method thereof and heat conduction, storage and dissipation device
  • Heat conduction and storage composite, preparation method thereof and heat conduction, storage and dissipation device
  • Heat conduction and storage composite, preparation method thereof and heat conduction, storage and dissipation device

Examples

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Effect test

Embodiment 1

[0043] This embodiment provides a heat-conducting heat-storage composite material, which sequentially includes a heat-conducting silica gel layer, a metal layer and a phase-change material layer.

[0044] The thermally conductive silica gel layer is prepared from the following raw materials in parts by weight:

[0045]

[0046]

[0047] A further embodiment is that the thickness of the heat-conducting silica gel layer is 0.12 mm.

[0048] A further embodiment is that the crosslinking agent (methyl hydrogen silicone oil) has a viscosity of 780-800 mPa·s at 25°C.

[0049] The metal layer is copper foil with a thickness of 0.06mm.

[0050] The phase change material layer is prepared from the following raw materials in parts by weight:

[0051]

[0052] The viscosity range of the high-viscosity polyisobutylene is 600-1200 mPa·s.

[0053] A further embodiment is that the phase change wax is selected from a mixture of micron granular paraffin wax and microcrystalline wax, ...

Embodiment 2

[0062] This embodiment provides a heat-conducting heat-storage composite material, which sequentially includes a heat-conducting silica gel layer, a metal layer and a phase-change material layer.

[0063] The thermally conductive silica gel layer is prepared from the following raw materials in parts by weight:

[0064]

[0065]

[0066] A further embodiment is that the thickness of the heat-conducting silica gel layer is 0.15 mm.

[0067] A further embodiment is that the crosslinking agent (methyl hydrogen silicone oil) has a viscosity of 820-850 mPa·s at 25°C.

[0068] The metal layer is gold foil with a thickness of 0.05 mm.

[0069] The phase change material layer is prepared from the following raw materials in parts by weight:

[0070]

[0071] The viscosity range of the high-viscosity polyisobutylene is 800-1400 mPa·s.

[0072] A further embodiment is that the phase change wax is selected from a mixture of micron granular paraffin wax and microcrystalline wax,...

Embodiment 3

[0080] This embodiment provides a heat-conducting heat-storage composite material, which sequentially includes a heat-conducting silica gel layer, a metal layer and a phase-change material layer.

[0081] The thermally conductive silica gel layer is prepared from the following raw materials in parts by weight:

[0082]

[0083] A further embodiment is that the thickness of the thermally conductive silica gel layer is 0.1mm.

[0084] A further embodiment is that the crosslinking agent (methyl hydrogen silicone oil) has a viscosity of 750-800 mPa·s at 25°C.

[0085] The metal layer is silver foil with a thickness of 0.07mm.

[0086] The phase change material layer is prepared from the following raw materials in parts by weight:

[0087]

[0088] The viscosity range of the high-viscosity polyisobutylene is 900-1200 mPa·s.

[0089] A further embodiment is that the phase-change wax is selected from a mixture of micron-sized granular microcrystalline wax, palm wax, and whit...

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Abstract

The invention discloses a heat conduction and storage composite, a preparation method thereof and a heat conduction, storage and dissipation device based on the heat conduction and storage composite,and relates to the technical field of heat conduction materials. The method comprises the following steps: raw materials are prepared: a, a piece of metal foil is taken, b, a heat conduction silica gel base material is taken, and c, a phase-change material base material is taken; the outer surface of one side of the metal foil is coated with the heat conduction silica gel base material, the metalfoil is placed in a tunnel furnace for vulcanization, and a heat conduction silica gel layer is formed after vulcanization; the outer surface of the other side of the metal foil is coated with the phase-change material base material, hot coating temperature is controlled at 80-90 DEG C, and a phase-change material layer is formed; finally, the heat conduction and storage composite is obtained. Byaid of the phase-change energy storage conduction technology, the heat conduction and storage composite stores and releases energy by physical state transformation and has the advantages that energy storage density is large, temperature is approximately constant, phase-change temperature conduction can be realized, and rapid cooling can be realized.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, and more specifically, to a heat-conducting heat-storage composite material and a preparation method thereof. And provide a heat conduction heat storage and heat dissipation device based on the composite material. Background technique [0002] Studies have shown that the life of electronic components is reduced by 50% for every 10°C increase in temperature. Therefore, in order to prevent local heat accumulation from forming hot spots, it is necessary to use high thermal conductivity materials to quickly transfer the heat away from the hot spots. At the same time, in order to adapt to the narrow and complex structure inside electronic equipment, high thermal conductivity materials are required to be ultra-thin and flexible. Usually, in order to solve the problem of heat dissipation of heat-generating electronic components, the industry places heat sinks above the electronic com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/06C09K5/14H01L23/373H01L23/427
CPCC09K5/063C09K5/14H01L23/3735H01L23/4275
Inventor 张亮刘成彬
Owner 苏州矽美科导热科技有限公司
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