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A wafer production process

A wafer and production method technology, applied in the field of wafer production technology, can solve the problems of wafer clamping, uniform etching, and technical solution limitations, etc., to increase the contact area, improve the etching effect, and increase the contact Effect

Active Publication Date: 2020-11-10
深圳市克拉尼声学科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The wet etching device of the present invention can handle the precipitation in the etching process, but this technical solution cannot clamp and etch wafers of different sizes uniformly, so that the technical solution is limited

Method used

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  • A wafer production process
  • A wafer production process
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Embodiment approach

[0039] As an embodiment of the present invention, the liquid blocking module 42 includes a No. 1 slider 421, a No. 1 guide rod 422, a floating block 423, a No. 2 guide rod 424, a No. 1 sliding telescopic rod 425, and a No. 3 slider 426. and a spherical stopper 427; the floating block 423 is fixedly connected with the No. 1 slider 421 through the No. 1 guide rod 422; the No. 1 slider 421 slides on the No. 1 chute 41; the slider 423 below is provided with three No. slider 426; No. 2 chute 428 is provided in the No. 3 slider 426; One end of No. 2 guide rod 424 is connected with floating block 423; The other end of No. 2 guide rod 424 is provided with No. 2 slider 429 , which is used to drive the movement of No. 3 slider 426; said No. 3 slider 426 is fixedly connected with spherical stopper 427 through one end of No. 1 sliding telescopic rod 425, and the other end of No. 1 sliding telescopic rod 425 is connected with No. The wall is fixedly connected; the spherical stopper 427 is ...

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Abstract

The invention belongs to the technical field of semiconductor manufacturing and in particular discloses a wafer production process. The process adopts a wet etching device, and the wet etching devicecomprises a cylinder I, a cylinder II and baffles, wherein the cylinder II is coaxially arranged inside the cylinder I; the baffles are circumferentially arranged inside the cylinder I; the cylinder Iis segmented into a sealing bin I, a sealing bin II and a sealing bin III by the baffles. According to the wet etching device, due to mutual match of a sliding telescopic rod II sleeving with a spring I and a spiral plate, the sliding telescopic rod II retracts in the vibrating process of the spiral plate, the wafer produces displacement, and the wafer is clamped again by the clamping unit afterthe displacement, so that the wafer is uniformly etched by the etching solution. Meanwhile, due to vibration of the spiral plate, etched and precipitated particles are separated from the wafer, and contact between the etching solution and the wafer is enlarged, so that the etching effect is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a wafer production process. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on silicon wafers, and become IC products with specific electrical functions. The raw material of the wafer is silicon, and there is an inexhaustible amount of silicon dioxide on the surface of the earth's crust. Silica ore is refined in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon. However, the traditional wafer production and etching process is uneven, and there are generally defects such as cumbersome process, high cost, and low good rate. [0003] In the prior art, there are also technical solutions for wet etching devic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B33/10C30B29/06H01L21/306
CPCC30B29/06C30B33/10H01L21/30604
Inventor 何雁波吴美娟韩柯王青江振
Owner 深圳市克拉尼声学科技有限公司
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