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A wafer wet etching device

A wet etching and wafer technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as wafer clamping, technical solution limitations, and uniform etching, etc., to increase the contact area , Improve the effect of etching and practicality

Inactive Publication Date: 2020-09-04
如东汇盛通半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The wet etching device of the present invention can handle the precipitation in the etching process, but this technical solution cannot clamp and etch wafers of different sizes uniformly, so that the technical solution is limited

Method used

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  • A wafer wet etching device
  • A wafer wet etching device
  • A wafer wet etching device

Examples

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Embodiment approach

[0024]As an embodiment of the present invention, the liquid blocking module 42 includes a No. 1 slider 421, a No. 1 guide rod 422, a floating block 423, a No. 2 guide rod 424, a No. 1 sliding telescopic rod 425, and a No. 3 slider 426. and a spherical stopper 427; the floating block 423 is fixedly connected with the No. 1 slider 421 through the No. 1 guide rod 422; the No. 1 slider 421 slides on the No. 1 chute 41; the slider 423 below is provided with three No. slider 426; No. 2 chute 428 is provided in the No. 3 slider 426; One end of No. 2 guide rod 424 is connected with floating block 423; The other end of No. 2 guide rod 424 is provided with No. 2 slider 429 , which is used to drive the movement of No. 3 slider 426; said No. 3 slider 426 is fixedly connected with spherical stopper 427 through one end of No. 1 sliding telescopic rod 425, and the other end of No. 1 sliding telescopic rod 425 is connected with No. The wall is fixedly connected; the spherical stopper 427 is u...

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Abstract

The invention, which belongs to the field of semiconductor technology, in particular relates to a wet etching apparatus for a wafer. The wet etching apparatus is composed of a cylinder I, a cylinder II, and baffles. The cylinder II is installed inside the cylinder I coaxially. The baffles are arranged inside the cylinder I in a circumferential direction and divide the cylinder I into a sealing chamber I, a sealing chamber II, and a sealing chamber III. According to the invention, on the basis of mutual cooperation of a sliding telescopic rod II sleeved by a spring I and a spiral plate, the sliding telescopic rod II stretches and contracts during the vibration process of the spiral plate and a wafer moves; and after the displacement, a clamping unit clamps the wafer again and thus an etching solution etches the wafer uniformly. Meanwhile, etched precipitated particles are separated from the wafer based on vibration of the spiral plate, so that contact between the etching solution and the wafer is increased and thus the etching effect is improved.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, in particular to a wafer wet etching device. Background technique [0002] Semiconductor technology refers to various technologies of semiconductor processing, including wafer growth technology, thin film deposition, photolithography, etching, doping technology and process integration and other technologies. At present, in the semiconductor manufacturing process, wet etching usually puts the wafer with silicon dioxide and silicon nitride in the etching tank to etch the wafer, and the etching tank is often loaded with phosphoric acid solution. Phosphoric acid is widely used in the etching of silicon nitride films because of the etching selectivity ratio of silicon nitride films to silicon dioxide. [0003] In the prior art, there are also technical solutions for wet etching devices. For example, a Chinese patent with application number 201420593668.7 discloses a wet etching device, includi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67075
Inventor 王青江振
Owner 如东汇盛通半导体科技有限公司
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