Film coating technology for circuit board
A circuit board and process technology, which is applied in the field of circuit board coating process, can solve the problems of film shedding and large impact on circuit board coating performance, and achieve the effects of improving performance, good insulation, and preventing shedding
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0023] A coating process for a circuit board, the process comprising:
[0024] (1) Connecting layer electrodeposition: place the cleaned circuit board in an electroplating solution containing thionium for electrodeposition. The electroplating solution containing thionium includes 15 parts of thionium, 100 parts of deionized water and 2 parts of potassium chloride , Electrodeposition adopts cyclic voltammetry, the process of cyclic voltammetry is -50-50V, current 5A, scanning voltage is 2V / s, and the number of scanning cycles is 100;
[0025] (2) Surface cleaning: soak and clean the preliminarily treated circuit board in flowing ultrapure water at a flow rate of 0.2m / s, rinse for 10min, take it out and dry it for later use;
[0026] (3) Soot blowing: Soot blowing is performed on the initially cleaned circuit board in a clean room, and clean nitrogen is used to blow soot on the circuit board at a flow rate of 1.6m / s for 0.5min;
[0027] (4) Static removal treatment: take out th...
Embodiment 2
[0032] A coating process for a circuit board, the process comprising:
[0033] (1) Connecting layer electrodeposition: place the cleaned circuit board in an electroplating solution containing thionium for electrodeposition. The electroplating solution containing thionium includes 18 parts of thionium, 1200 parts of deionized water and 4 parts of potassium chloride , Electrodeposition adopts cyclic voltammetry, the process of cyclic voltammetry is -50-50V, current 5A, scanning voltage is 2V / s, and the number of scanning cycles is 160;
[0034] (2) Surface cleaning: soak and clean the preliminarily treated circuit board in flowing ultrapure water at a flow rate of 0.4m / s, rinse for 12min, take it out and dry it for later use;
[0035] (3) Soot blowing: Soot blowing is performed on the initially cleaned circuit board in a clean room, and clean nitrogen is used to blow soot on the circuit board at a flow rate of 1.6m / s for 0.8min;
[0036] (4) Static removal treatment: take out t...
Embodiment 3
[0041] A coating process for a circuit board, the process comprising:
[0042] (1) Connecting layer electrodeposition: place the cleaned circuit board in an electroplating solution containing thionium for electrodeposition, the electroplating solution containing thionium includes 20 parts of thionium, 150 parts of deionized water and 5 parts of potassium chloride , Electrodeposition adopts cyclic voltammetry, the process of cyclic voltammetry is -50-50V, current 5A, scanning voltage is 2V / s, and the number of scanning circles is 200 circles;
[0043] (2) Surface cleaning: soak and clean the preliminarily treated circuit board in flowing ultrapure water at a flow rate of 0.5m / s, rinse for 15min, take it out and dry it for later use;
[0044] (3) Soot blowing: Soot blowing is performed on the initially cleaned circuit board in a clean room, and clean nitrogen is used to blow soot on the circuit board at a flow rate of 1.6m / s for 1.2min;
[0045](4) Static removal treatment: tak...
PUM
| Property | Measurement | Unit |
|---|---|---|
| electrical resistance | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More