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Thin film packaging method and device, thin film packaging system and solar cell

A thin-film packaging and device technology, which is applied to semiconductor devices, circuits, photovoltaic power generation, etc., can solve the problem of easy and slow intrusion of water vapor

Active Publication Date: 2018-11-13
DONGJUN NEW ENERGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the thickness of the inorganic film is usually thin, and there are some defects such as holes or cracks, water vapor is still easy to invade slowly, so it is still difficult to maintain a good packaging effect for a long time with this alternate stacked structure.

Method used

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  • Thin film packaging method and device, thin film packaging system and solar cell
  • Thin film packaging method and device, thin film packaging system and solar cell
  • Thin film packaging method and device, thin film packaging system and solar cell

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Embodiment Construction

[0053] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.

[0054] Considering that the core material of the solar cell module is very sensitive to water vapor, it is necessary to adopt a specific packaging structure to prevent the intrusion of water vapor, so as to ensure the power generation efficiency of the solar cell. In related technologies, an alternate lamination structure of organic thin films and inorganic thin films is mainly used to realize t...

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Abstract

The invention relates to a thin film packaging method and device, a thin film packaging system and a solar cell. The thin film packaging method comprises the following steps of forming an inorganic barrier film on an electronic device with a metal oxide thin film, wherein the inorganic barrier film is positioned on the surface of the metal oxide thin film; and performing reduction treatment on theelectronic device, so that the metal oxide thin film is subjected to a reduction reaction to obtain corresponding molten metal, and the molten metal is filled and solidified in the pores of the inorganic barrier film. By virtue of the technical scheme, the pores in the inorganic barrier layer can be repaired, so that the effect of film packaging is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a thin film packaging method and device, a thin film packaging system, and a solar cell. Background technique [0002] In recent years, the increasingly prominent traditional energy issues have promoted the rapid development of new energy sources, especially clean energy represented by solar energy has received high attention and widespread attention. Since the core material in the solar cell module is very sensitive to water vapor, and exposure to the atmosphere can easily cause its power generation efficiency to attenuate, so it is very important to adopt an effective packaging structure to ensure the power generation efficiency of the solar cell module. [0003] Currently common packaging structures include alternate stacked packaging structures of organic thin films and inorganic thin films. However, since the thickness of the inorganic film is usually thin, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/048H01L31/18
CPCH01L31/048H01L31/0481H01L31/18Y02E10/50C23C14/08C23C14/5826C23C16/40C23C16/56H01L31/1876
Inventor 张鹏举李胜春谈笑天鱼志坚张雨
Owner DONGJUN NEW ENERGY CO LTD