A wiping method for solving blockage of smt stencil and tin blowing device thereof

A stencil and solder paste technology, applied in the direction of assembling printed circuits, printed circuits, and electrical components with electrical components, can solve problems such as poor soldering quality, and achieve the effect of enhancing the output of good products, excellent performance, and good economic benefits

Active Publication Date: 2021-08-06
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Applicable to all PCBAs, it effectively solves the poor printing of PCB caused by the blockage of STM stencil, and solves the problem of poor soldering quality through the design of the process method, as well as the maintenance cost and labor cost caused by the defect

Method used

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  • A wiping method for solving blockage of smt stencil and tin blowing device thereof
  • A wiping method for solving blockage of smt stencil and tin blowing device thereof

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Embodiment Construction

[0031] In order to better understand the present invention, the specific implementation manners of the present invention will be explained in detail below in conjunction with the accompanying drawings.

[0032] A kind of wiping method that solves SMT stencil blockage, its step comprises:

[0033] 1. The scraper moves to the front of the printing area to remove the SMT stencil;

[0034] 2. Put the solder paste on the SMT stencil into the solder paste bottle. The solder paste must be used up within the validity period of opening, otherwise it will be discarded;

[0035] 3. Use dust-free paper to wipe the upper and lower sides of the STM stencil;

[0036] 4. Apply the cleaning agent on the dust-free paper and wipe the upper and lower sides of the STM stencil again. When wiping, wipe back and forth in the horizontal and vertical directions. The wiping pressure is lower than the plastic deformation pressure of the STM stencil;

[0037] 5. Use a tin blowing device to blow off the ...

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Abstract

The invention discloses a wiping method for solving the clogging of SMT stencils. The steps include: applying a cleaning agent on dust-free paper and wiping the upper and lower sides of the STM stencil again, and wiping back and forth in horizontal and vertical directions during wiping, with low wiping pressure Based on the plastic deformation pressure of the STM stencil; use a tin blowing device to blow off the residual solder paste on the hole wall of the STM stencil, and at the same time take a dust-free paper to accept the blown solder paste under the stencil. It is 0.8‑1.2MPa; use dust-free paper to wipe off the residual cleaning agent attached to the front and back of the STM stencil; it can completely clean the residual solder paste on the hole wall of the STM stencil, which is much more effective than the automatic cleaning that comes with the equipment , especially the use of dust-free paper with cleaning agent mentioned in step 4 to clean the solder paste attached to the surface of the STM stencil, and then use a tin blowing device to blow off the residual solder paste in the hole wall.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a wiping process method and a tin blowing device for solving SMT screen blockage. Background technique [0002] At present, many components of PCB (printed circuit board) are chip components, and there is no soldering pin jack. When soldering, solder paste needs to be printed on the corresponding solder joints, and then the chip components are soldered to the PCB (printed circuit board). We call it SMT (Surface Mount Technology). [0003] The important quality control link of PCBA (soldered circuit board) is the SMT printing station. It can be said that the printing station is the first process of the entire SMT production process, and it is also the most important process. The quality of PCB (printed circuit board) printing directly affects the soldering quality of PCBA, which is related to the production yield of the entire SMT. [0004] The approximate printing process...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/341H05K2203/0126
Inventor 张小行
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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