Quakeproof wafer grinder

Abstract

The invention discloses a quakeproof wafer grinder. The quakeproof wafer grinder comprises a wafer grinder body; a grinding base is arranged on the upper surface of the wafer grinder body; the grinding base is fixedly arranged on the upper surface of the wafer grinder body; a rotary wheel is arranged in the grinding base; a cleaning brush is arranged on the outer surface of the rotary wheel; a slag emission pipe is arranged in the grinding base, penetrates through the inner part of the wafer grinder body and extends to the bottom of the wafer grinder body; a rotary motor, the rotary wheel, a grinding cover, a grinding wheel and a buffering spring are adopted, so that the rotary wheel is driven by the rotary motor; meanwhile, the grinding wheel clings to a wafer under the effect of the buffering spring; the wafer is enabled to rotate to be grinded; the wafer grinding efficiency is improved; the wafer grinding time is shortened; a supporting rod and a bearing are adopted at the lower part of each wafer groove, so that during a grinding process of wafers, the wafer grooves rotate around the bearings under the effect of grinding, and the grinding uniformity of the wafers is improved.

Description

technical field [0001] The invention belongs to the technical field of wafer grinding equipment, and in particular relates to an anti-shock wafer grinding machine. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and become an IC with specific electrical functions. product. The raw material of the wafer is silicon, and the surface of the earth's crust has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon, in which the wafers are 8 inches and 12 inches in size. During the use of the existing wafer grinder, the stability of wafer grinding is poor, which may easily cause the deflection of the wafer during the grinding pro...

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Problems solved by technology

[0003] The object of the present invention is to provide an anti-vibration wafer grinder to solve the problem of poor stability of wafer grinding during the use of the wafer grinder proposed in the above background technology, which may easily cause deviation of the wafer during grinding. Slant, reducing the wafer grinding pass rate

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