Compound high-dielectric strength electronic material

A technology of electronic materials and dielectric strength, which is applied in the field of electronic materials with composite high-strength dielectric strength, can solve the problems of general dielectric strength, single applicability, and different processing components, and achieve good quality stability, strong applicability, The effect of high dielectric strength

Inactive Publication Date: 2018-11-23
太仓天润新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The dielectric strength of the electronic materials used in the prior art is averag

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0013] Example one

[0014] The parts by weight of each component in the composite high-strength electronic material are specifically: the calcium titanate accounts for 15 parts, the hexagonal boron nitride accounts for 13 parts, the ethanol accounts for 6 parts, and the Glass powder accounted for 19 parts, the polycarbonate accounted for 27 parts, the polytetrafluoroethylene accounted for 10 parts, and the aminopropyltriethoxysilane accounted for 4 parts.

Example Embodiment

[0015] Example two

[0016] The parts by weight of the components in the composite high-strength electronic material are specifically: the calcium titanate accounts for 16 parts, the hexagonal boron nitride accounts for 14 parts, and the ethanol accounts for 7 parts. Glass powder accounted for 20 parts, the polycarbonate accounted for 28 parts, the polytetrafluoroethylene accounted for 11 parts, and the aminopropyltriethoxysilane accounted for 5 parts.

Example Embodiment

[0017] Example three

[0018] The parts by weight of each component in the composite high dielectric strength electronic material are specifically: the calcium titanate accounts for 17 parts, the hexagonal boron nitride accounts for 15 parts, the ethanol accounts for 8 parts, and the Glass powder accounted for 23 parts, the polycarbonate accounted for 31 parts, the polytetrafluoroethylene accounted for 14 parts, and the aminopropyltriethoxysilane accounted for 8 parts.

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PUM

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Abstract

The invention discloses a compound high-dielectric strength electronic material. The compound high-dielectric strength electronic material is prepared from the following components in parts by weight:15-21 parts of calcium titanate, 13-18 parts of hexagonal boron nitride, 6-11 parts of ethyl alcohol, 19-26 parts of glass powder, 27-35 parts of polycarbonate, 10-16 parts of teflon and 4-10 parts of aminopropyltriethoxysilane. The compound high-dielectric strength electronic material has the characters of high dielectric strength, large resistance, high applicability and good quality stability.

Description

technical field [0001] The invention relates to a composite electronic material with high dielectric strength. Background technique [0002] Electronic materials refer to materials used in electronic technology and microelectronic technology, including dielectric materials, semiconductor materials, piezoelectric and ferroelectric materials, conductive metals and their alloy materials, magnetic materials, optoelectronic materials, electromagnetic wave shielding materials and other related materials. Material. Electronic materials are the material basis for the development of modern electronics industry and science and technology, and are also technology-intensive subjects in the field of science and technology. It involves multidisciplinary knowledge such as electronic technology, physical chemistry, solid state physics and process foundation. According to the chemical properties of the material, it can be divided into metal electronic materials, electronic ceramics, polyme...

Claims

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Application Information

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IPC IPC(8): C08L69/00C08L27/18C08K13/02C08K3/40C08K3/24C08K5/544C08K3/38
CPCC08L69/00C08K2003/385C08L2203/20C08L27/18C08K13/02C08K3/40C08K3/24C08K5/544C08K3/38
Inventor 张安琪
Owner 太仓天润新材料科技有限公司
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