Compound high-dielectric strength electronic material
A technology of electronic materials and dielectric strength, which is applied in the field of electronic materials with composite high-strength dielectric strength, can solve the problems of general dielectric strength, single applicability, and different processing components, and achieve good quality stability, strong applicability, The effect of high dielectric strength
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Embodiment 1
[0014] The parts by weight of each component in the composite high dielectric strength electronic material are specifically: the calcium titanate accounts for 15 parts, the hexagonal boron nitride accounts for 13 parts, the ethanol accounts for 6 parts, and the The glass powder accounts for 19 parts, the polycarbonate accounts for 27 parts, the polytetrafluoroethylene accounts for 10 parts, and the aminopropyltriethoxysilane accounts for 4 parts.
Embodiment 2
[0016] The parts by weight of each component in the composite high-dielectric strength electronic material are specifically: the calcium titanate accounts for 16 parts, the hexagonal boron nitride accounts for 14 parts, the ethanol accounts for 7 parts, and the The glass powder accounts for 20 parts, the polycarbonate accounts for 28 parts, the polytetrafluoroethylene accounts for 11 parts, and the aminopropyltriethoxysilane accounts for 5 parts.
Embodiment 3
[0018] The parts by weight of the components in the composite high-dielectric strength electronic material are specifically: the calcium titanate accounts for 17 parts, the hexagonal boron nitride accounts for 15 parts, the ethanol accounts for 8 parts, and the The glass powder accounts for 23 parts, the polycarbonate accounts for 31 parts, the polytetrafluoroethylene accounts for 14 parts, and the aminopropyltriethoxysilane accounts for 8 parts.
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