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Array substrate, display panel and cutting method thereof

An array substrate and display panel technology, applied in static indicators, instruments, nonlinear optics, etc., can solve the problems of reducing product yield and reliability, improve yield and reliability, and reduce burns on the driving circuit layer the possible effect of

Active Publication Date: 2021-07-09
XIAMEN TIANMA MICRO ELECTRONICS
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] According to the existing laser cutting process conditions, during the laser cutting process, the laser laser path is cut from the edge of the display motherboard to the inside of the display motherboard. The display motherboard usually includes a glass substrate, and the laser cutting process will produce more Large heat energy, when the laser passes through the edge of the display motherboard due to the unevenness of the edge of the glass substrate, the laser light is scattered at the edge of the glass substrate, and when the scattered light hits the circuit structure in the non-display area of ​​the display motherboard, it is very likely to cause The electronic components in the circuit structure are burned and damaged, which greatly reduces the yield and reliability of the product

Method used

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  • Array substrate, display panel and cutting method thereof
  • Array substrate, display panel and cutting method thereof
  • Array substrate, display panel and cutting method thereof

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Embodiment Construction

[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0035] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0036] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses an array substrate, a display panel and a cutting method thereof, and relates to the field of display technology. It is provided with a display area and a non-display area. The non-display area includes a first non-display area surrounding the display area and a In the binding area on one side, the non-display area has at least one first special-shaped border, the first special-shaped border includes a first sub-special-shaped border, and the first sub-special-shaped border is located in the first non-display area; the array substrate includes: a base substrate; A light-shielding layer is located in the non-display area and is arranged on one side of the base substrate. The orthographic projection of the first light-shielding layer on the plane where the base substrate is located overlaps at least part of the first sub-shaped boundary; and the driving circuit layer is located in the non-display area. The display area is arranged on the side of the first light-shielding layer away from the base substrate. The first light-shielding layer overlapped with the first sub-shaped boundary is arranged in the first non-display area to block the light energy of the laser sputtering from entering the display panel, thereby improving the product yield.

Description

technical field [0001] The present invention relates to the field of display technology, and more specifically, to an array substrate, a display panel and a cutting method thereof. Background technique [0002] In the manufacturing process of the existing display panel, the entire display motherboard is usually cut to obtain a display panel with a suitable size and shape, and laser cutting is a commonly used cutting method. The non-display area (that is, the frame area) on the display motherboard is usually provided with some circuit structures, such as gate drive circuits, etc., and the circuit structures usually include electronic components. [0003] According to the existing laser cutting process conditions, during the laser cutting process, the laser laser path is cut from the edge of the display motherboard to the inside of the display motherboard. The display motherboard usually includes a glass substrate, and the laser cutting process will produce more Large heat en...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/133G02F1/1333G02F1/1335
CPCG02F1/13306G02F1/133351G02F1/133512
Inventor 张孝斌蔡宗翰康建松王建安陈国照
Owner XIAMEN TIANMA MICRO ELECTRONICS
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