Regular polygonal cylinder anode and method for preparing large-area metal microstructure through electrodeposition

Abstract

The invention discloses a regular polygonal cylinder anode and a method for preparing a large-area metal microstructure through electrodeposition. The regular polygonal cylinder anode is composed of acylinder anode body with cross section being a regular polygon and an electric insulation mask with a hollow pattern array. The method for preparing the large-area metal microstructure through electrodeposition of the regular polygonal cylinder anode in tank liquid includes: closely fitting the regular polygonal cylinder anode above a conductive substrate to enable liquid level of electrolyte toonly immerse the mask hollow pattern array downmost below the regular polygonal cylinder anode; connecting an electrodeposition power source positive electrode with the regular polygonal cylinder anode and a negative electrode with the conductive substrate, and electrodepositing out a microstructure array copied to the mask hollow pattern array on the conductive substrate under action of electrochemistry; acquiring multiple columns of microstructure arrays copied to different mask surfaces at different positions by clockwise or anticlockwise rotating the polygonal cylinder anode so as to realize modular forming of the large-area metal microstructure.

Description

technical field [0001] The invention belongs to the technical field of electrochemical processing, and relates to a regular polygonal column anode and a method for preparing a metal microstructure, in particular to a method for preparing a large-area metal microstructure by electrodepositing a regular polygonal column anode. Background technique [0002] In the fields of high-definition flat panel display, high-efficiency solar panels, LED graphics, wafer-level micro-nano optical devices, etc., with the development of high-performance, high-precision, and high-integration technology products, large-area microstructure arrays have great potential. Very huge industrial demand. The common feature of these products is that large-area complex microstructure arrays need to be manufactured efficiently and at low cost on large-scale substrates or substrates. However, the existing micro-nano manufacturing technologies (such as electron beam lithography, optical lithography, laser in...

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Problems solved by technology

However, when the mask electrodeposition process is applied to the formation of large-area metal micro-features, it is usually produced by hanging the cathode and the large-area cathode mask vertically in the bath. Not only the film-making process is complicated, but the production equipment technology The requirements are strict, the cost is high, and it is difficult to ensure the uniform thickness of the mask in a large area, which affects the molding quality of the microstructure

Despite this, the vast number of scientific and technical personnel still try their best to enhance the mass transfer effect of the liquid phase by means of ultrasonic stirring, magnetic convection, and centrifugation, or to improve the uniformity of current density distribution by setting auxiliary cathodes and applying array anodes. , but the effect of preparing metal microstructures is mostly unsatisfactory, and the process stability needs to be improved

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