Method for preparing oxide dispersion strengthened copper composite material

A dispersion-strengthened copper and composite material technology, which is applied in the field of copper alloy material preparation, can solve the problems of easy segregation, Y incorporation, uneven distribution of dispersed phase, etc., and achieve the effect of loose conditions, easy operation and uniform distribution

Inactive Publication Date: 2018-11-30
UNIV OF SCI & TECH BEIJING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Cu-Y prepared by vacuum melting method 2 o 3 Composite materials, generating brittle Cu-Y intermetallic compounds at their grain boundaries, the presence of these intermetallic compounds will deteriorate the performance of the material
However, the reported Cu-Y by mechanical alloying 2 o 3 It is found in the literature of composite materials that ther

Method used

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  • Method for preparing oxide dispersion strengthened copper composite material

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0017] Example 1

[0018] 1. Weigh 74.4g of Cu powder, place it in a hydrogen reduction furnace, and reduce it at 400°C for 1h.

[0019] 2. The reduced Cu powder and 0.8wt% Y powder are fully mixed and then packaged together with the grinding balls in a ball mill tank. The ball-to-material ratio is 10:1, and 6wt% ethanol is added as a process control agent, and then the ball is milled. The jar was fixed in a planetary ball mill and milled at 350 rpm for 50 h.

[0020] 3. Under vacuum conditions, the alloy powder obtained after mechanical alloying was annealed at 300°C for 5h in a muffle furnace.

[0021] 4. The alloy powder obtained after ball milling is placed in a mold, and is sintered and formed in a spark plasma sintering furnace under the conditions of 850° C., 50 MPa, and 8 min.

[0022] 5. Roll the sintered copper alloy block to 10% of the original thickness.

[0023] 6. Heat treatment of the rolled copper alloy plate under an inert atmosphere, the heat treatment con...

Example Embodiment

[0024] Example 2

[0025] 1. Weigh 74.25g of Cu powder, place it in a hydrogen reduction furnace, and reduce it at 450°C for 0.5h.

[0026] 2. The reduced Cu powder and 1wt% Y powder are fully mixed and then packaged together with the grinding balls in a ball mill tank, the ball-to-material ratio is 10:1, and 6wt% ethanol is added as a process control agent, and then the ball mill tank is mixed. It was fixed in a planetary ball mill and milled at 300rpm for 60h.

[0027] 3. Under vacuum conditions, the alloy powder obtained after mechanical alloying was annealed at 350°C for 4.5h in a muffle furnace.

[0028] 4. The alloy powder obtained after ball milling is placed in a mold, and is sintered and formed in a discharge plasma sintering furnace under the conditions of 900° C., 50 MPa, and 5 min.

[0029] 5. Roll the sintered copper alloy block to 50% of the original thickness.

[0030] 6. In an inert atmosphere, heat treatment of the rolled copper alloy plate, the heat treatm...

Example Embodiment

[0032] Example 3

[0033] 1. Weigh 49.25g of Cu powder, place it in a hydrogen reduction furnace, and reduce it at 450°C for 0.5h.

[0034] 2. The reduced Cu powder and 1.5wt% Y powder are fully mixed and then packaged together with the grinding balls in a ball mill tank, the ball-to-material ratio is 15:1, and 6wt% ethanol is added as a process control agent, and then the ball is milled. The jar was fixed in a planetary ball mill and milled at 300 rpm for 50 h.

[0035] 3. Under vacuum conditions, the alloy powder obtained after mechanical alloying was annealed at 400°C for 4h in a muffle furnace.

[0036] 4. The alloy powder obtained after ball milling is placed in a mold, and is sintered and formed in a discharge plasma sintering furnace under the conditions of 900° C., 40 MPa, and 8 min.

[0037] 5. Roll the sintered copper alloy block to 80% of the original thickness

[0038] 6. In an inert atmosphere, heat treatment of the rolled copper alloy plate, the heat treatment...

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Abstract

The invention relates to a method for preparing an oxide dispersion strengthened copper composite material, and belongs to the field of preparation of copper alloy materials. The method is as follows:firstly reducing Cu powder; alloying element powder, to be more specific, thoroughly mixing the reduced Cu powder with an appropriate amount of Y powder to obtain a Cu powder and Y powder mixture, then packaging the Cu powder and Y powder mixture and grinding balls in a stainless steel ball mill tank, and performing ball milling under an inert gas atmosphere; after the ball milling, annealing alloyed alloy powder by a muffle furnace, and sintering the annealed alloy powder into a block by a discharge plasma sintering furnace, and then rolling the block into a desiring thickness; and finally using a muffle furnace to perform heat treatment on the rolled copper alloy, and cooling in the furnace to obtain the oxide dispersion strengthened copper composite material. The oxide dispersion strengthened copper composite material prepared by the method has uniform distribution of nano-oxide particles with an average size of 5-6 nm, the powder production rate is over 95%, and the process is simple and easy to operate.

Description

technical field [0001] The invention belongs to the field of preparation of copper alloy materials, in particular to a method for strengthening copper composite materials by using oxide dispersion. Background technique [0002] Dispersion strengthened copper composites have excellent physical and mechanical properties, including room temperature strength and high temperature strength, wear resistance, electrical conductivity, thermal conductivity and fusion welding resistance, etc. The more common types of dispersed phases in copper are Al 2 o 3 , Y 2 o 3 wait. and Al 2 o 3 Compared to Y 2 o 3 It has a fluorite-like structure and forms a coherent relationship with the copper matrix, resulting in a spinel-structured Al 2 o 3 Precipitation strengthening that cannot be formed by particles. In addition, Y 2 o 3 The thermal stability of rare earth elements is high, and the extremely low solid solubility and small diffusion rate of rare earth elements in the copper la...

Claims

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Application Information

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IPC IPC(8): C22C1/05C22C9/00C22C32/00B22F3/105
CPCB22F3/105B22F2003/1051C22C1/0425C22C1/05C22C9/00C22C32/0021
Inventor 常永勤李吴铭张旖珉刘栋李明洋
Owner UNIV OF SCI & TECH BEIJING
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