Photo-thermal double-curing 3D printing resin composition
A resin composition, 3D printing technology, applied in the field of 3D printing, can solve the problem of no heat-curable epoxy resin, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0024] A kind of photo-thermal dual curing 3D printing resin composition comprises 43 parts by mass of polyurethane acrylate (U-6282) and 43 parts by mass of pentaerythritol tetraacrylate, 4 parts by mass of photoinitiator 2,4,6-trimethyl Benzoyl-diphenylphosphine oxide, 9 parts by mass of aliphatic epoxy resin 4,5-epoxycyclohexane-1,2-diglycidyl dicarboxylate, 1 part by mass of imidazole latent heat Curing agent Kingcure 390.
Embodiment 2
[0026] A light-thermal dual curing 3D printing resin composition includes 44 parts by mass of polyether acrylate and 22 parts by mass of trihydroxypropane triacrylate, 2 parts by mass of photoinitiator 2-hydroxyl-2-methyl- 1-phenylacetone, 29 parts by mass of bisphenol A epoxy resin E51, and 3 parts by mass of imidazole latent thermosetting agent Kingcure 390.
Embodiment 3
[0028] A light-thermal hybrid curing 3D printing resin composition includes 46 parts by mass of epoxy acrylate and 30 parts by mass of acryloylmorpholine, and 3 parts by mass of photoinitiator 2-hydroxyl-2-methyl-1-[ 4-(2-hydroxyethoxy)phenyl]-1-propanone, 19 parts by mass of 5,5-dimethylhydantoin epoxy resin, and 2 parts by mass of imidazole latent thermosetting agent Kingcure 390.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com