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Defect detection device and method for transmissive elements based on multi-wavelength iterative algorithm

An iterative algorithm and defect detection technology, applied in the field of optical detection, can solve the problems of lithographic sample defects, appearing on the substrate surface or buried in the multilayer film or mask surface, waste products, etc., to achieve convenient detection and coherent test optical path Sexual requirements are low and the effect of avoiding damage

Inactive Publication Date: 2018-12-07
INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI
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Problems solved by technology

In the manufacture of integrated circuit boards, even if dust pollution, impurity particles, bulges, and pits in the nanometer range appear on the surface of the substrate or are buried inside the multilayer film or on the surface of the mask, it will cause serious defects in the photolithography sample. produce waste

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  • Defect detection device and method for transmissive elements based on multi-wavelength iterative algorithm
  • Defect detection device and method for transmissive elements based on multi-wavelength iterative algorithm
  • Defect detection device and method for transmissive elements based on multi-wavelength iterative algorithm

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Embodiment

[0062] In this embodiment, a transmissive element, the letter e, is mounted on a film, and the film is plated with a certain thickness on a glass plate, and an area of ​​the letter e that does not transmit. The fixed-wavelength beam emitted by the tunable solid-state laser is expanded into collimated parallel light with a wide beam by the laser collimator beam expander. After diffraction, the 15mm radiation is transmitted to the detector.

[0063] In the measurement method of the transmissive component defect detection device based on the multi-wavelength iterative algorithm, the transmissive component defect detection steps are:

[0064] (1) The tunable solid-state laser generates seven kinds of incident light with wavelengths of 470nm, 500nm, 530nm, 550nm, 580nm, 600nm, and 630nm respectively. After testing the optical path, seven diffraction light intensity diagrams passing through the object to be measured are obtained, as shown in Figure (3) shown.

[0065] (2) Convert ...

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Abstract

The invention discloses a defect detection device and method for transmissive elements based on a multi-wavelength iterative algorithm. In an experimental device of a multi-wavelength gradient accelerated iterative phase recovery algorithm, a solid laser with the adjustable band range above 150nm and having good performance is adopted to form seven kinds of incident light with different wavelength, and multiple scattering light intensity images after defect transmission are collected by a detector; the phase plane information of the input wavefront of the incident light is recovered for the collected intensity images by using the multi-wavelength gradient accelerated iterative phase recovery algorithm; and the phase plane information of the input wavefront of the incident light is obtained, and the width and height information of the defect is obtained by reckoning. The algorithm in the invention has the advantages of high recovery speed and high detection accuracy. A diffraction pattern is collected at a fixed position, which avoids the movement of the light path. The device and the method are suitable for defect detection of transmissive elements.

Description

technical field [0001] The invention belongs to the technical field of optical detection, in particular to a defect detection device and method for a transmissive element based on a multi-wavelength iterative algorithm. Background technique [0002] With the rapid development of integrated circuit technology, the United States, Europe, Japan, South Korea and China Taiwan have higher and higher requirements for the minimum width accuracy of integrated circuit board engraving lines. In the manufacture of integrated circuit boards, even if dust pollution, impurity particles, bulges, and pits in the nanometer range appear on the surface of the substrate or are buried inside the multilayer film or on the surface of the mask, it will cause serious defects in the photolithography sample. Produce waste. The defect control of integrated circuit boards is already one of the bottlenecks in the development of next-generation lithography technology, and effective and fast detection meth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00
CPCG06T7/0004G06T2207/30148
Inventor 赵彦吴永前刘锋伟肖向海
Owner INST OF OPTICS & ELECTRONICS - CHINESE ACAD OF SCI