Controllable preparation method based on high-stacking-degree graphene modified high-thermal-conductivity carbon-plastic alloy

A graphene modification, graphene technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of low thermal conductivity of composite materials, large contact thermal resistance of graphene, high filler addition, etc., to achieve The best cost performance, to achieve the effect of cost performance

Active Publication Date: 2018-12-11
XIAMEN KNANO GRAPHENE TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The physical exfoliated graphene has a wide particle size and layer distribution, and is limited to graphene with a single mesh when used, and the thermal conductivity of the obtained composite material is not high, and it is in the same level range
Graphene with a single size has the following problems in heat conduction applications: small-sized graphene has a large contact thermal resistance, requires a relatively high amount of fillers, high cost, and has a great impact on the mechanical properties of composite materials; large and medium-sized graphene is easy to Form a heat conduction path, but the degree of stacking is small, and it is easy to generate gaps, resulting in an insufficient heat conduction network and low heat conduction value

Method used

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  • Controllable preparation method based on high-stacking-degree graphene modified high-thermal-conductivity carbon-plastic alloy
  • Controllable preparation method based on high-stacking-degree graphene modified high-thermal-conductivity carbon-plastic alloy
  • Controllable preparation method based on high-stacking-degree graphene modified high-thermal-conductivity carbon-plastic alloy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Weigh 0.1 g of anionic surfactant sodium dodecylbenzene sulfonate and dissolve it in 1984.9 g of medium to obtain a surfactant solution. Get 10g graphene A (particle size D 50 7-20μm, the number of layers is 3-10 layers, the bulk density is 0.01-0.03g / ml) and 5g graphene B (particle size D 503-7 μm, the number of layers is 1-3, and the bulk density is 0.01-0.02g / ml) respectively added to the above surfactant solution, fully stirred, moistened, and mixed uniformly in a homogenizer to obtain a graphene solution.

[0040] Weigh 0.5 g of anionic surfactant sodium dodecylbenzene sulfonate and dissolve it in 1874.5 g of medium to obtain a surfactant solution. Get 40g nano-graphite microchip C (particle size D 50 40-200μm, the number of layers is 100-300 layers, the bulk density is 0.4-1.0g / ml) and 85g nano-graphite microflake D (particle size D 50 5-40μm, the number of layers is 10-100 layers, and the bulk density is 0.1-0.4g / ml) respectively added to the above-mentioned s...

Embodiment 2

[0044] Weigh 0.8 g of anionic surfactant sodium lauryl sulfate and dissolve it in 1960.2 g of medium to obtain a surfactant solution. Get 30g graphene A (particle size D 50 7-20μm, the number of layers is 3-10 layers, the bulk density is 0.01-0.03g / ml) and 9g graphene B (particle size D 50 3-7 μm, the number of layers is 1-3, and the bulk density is 0.01-0.02g / ml) respectively added to the above surfactant solution, fully stirred, moistened, and mixed uniformly in a sand mill to obtain a graphene solution.

[0045] Weigh 1.5 g of anionic surfactant sodium lauryl sulfate and dissolve it in 1821.5 g of medium to obtain a surfactant solution. Get 62g nano-graphite microchip C (particle size D 50 40-200μm, the number of layers is 100-300 layers, the bulk density is 0.4-1.0g / ml) and 115g nanographite microflake D (particle size D 50 5-40 μm, the number of layers is 10-100 layers, and the bulk density is 0.1-0.4g / ml) respectively added to the above-mentioned surfactant solution, ...

Embodiment 3

[0049] Weigh 2g of hydroxymethylpropylcellulose and dissolve it in 1974g of medium to obtain a surfactant solution. Get 18g graphene A (particle size D 50 7-20μm, the number of layers is 3-10 layers, the bulk density is 0.01-0.03g / ml) and 6g graphene B (particle size D 50 3-7 μm, the number of layers is 1-3 layers, and the bulk density is 0.01-0.02g / ml) respectively added to the above surfactant solution, fully stirred, moistened, and mixed uniformly in a ball mill to obtain a graphene solution.

[0050] Weigh 2.15g of hydroxymethylpropylcellulose and dissolve it in 1814.85g of medium to obtain a surfactant solution. Get 35g nano-graphite microchip C (particle size D 50 40-200μm, the number of layers is 100-300 layers, the bulk density is 0.4-1.0g / ml) and 148g nanographite microflake D (particle size D 50 5-40 μm, the number of layers is 10-100 layers, and the bulk density is 0.1-0.4g / ml) respectively added to the above-mentioned surfactant solution, fully stirred, moistene...

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Abstract

The invention discloses a controllable preparation method based on high-stacking-degree graphene modified high-thermal-conductivity carbon-plastic alloy. The carbon-plastic alloy is prepared from thefollowing components in percentage by weight: high-stacking-degree graphene filler: 5 to 50%, thermosetting resin: 30 to 55%, a coupling agent: 0.2 to 2%, a resin diluent: 1 to 5%, a curing agent: 7 to 15%, reinforcing filler: 5 to 20%, and an auxiliary agent: 2 to 5%. The high-stacking-degree graphene filler is composed of carbon materials of four different specifications, wherein graphene A accounts for 5 to 15%, graphene B accounts for 2 to 5%, nanographite microchip C accounts for 15 to 45%, and nanographite microchip D accounts for 35 to 78%. The high-stacking-degree graphene filler is added to a thermosetting resin matrix to form a perfect heat transfer passage, and the high-thermal-conductivity carbon-plastic alloy material having a thermal-conductivity coefficient of 10-25 W/m.K can be controllably prepared. The high-thermal-conductivity carbon-plastic alloy prepared by the invention can be processed into various heat dissipation components by compression molding or injection molding, and is suitable for industrial heat dissipation, illumination heat dissipation, heat dissipation of electronic devices, etc.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, and in particular relates to a controllable preparation method based on high-packing-degree graphene-modified high-heat-conducting carbon-plastic alloy. Background technique [0002] As an important polymer compound material, plastic has a wide range of applications. Due to its advantages of high design freedom, easy processing and low cost, etc., plastics are gradually being used to replace metal applications. However, compared with the high thermal conductivity of metals, the thermal conductivity of plastics is generally poor. The application of plastics in the field of heat conduction and heat dissipation is limited. [0003] Graphene is a new type of two-dimensional carbon material that has been found to be the thinnest, the strongest, and the most conductive and thermally conductive. The thermal conductivity of graphene is as high as 5300W / m·K, which is much higher than t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08L39/06C08K9/04C08K3/04C08K7/00C08K9/06C08K3/26C08L67/06C08L29/04C08K7/06C08K7/14C08L63/00C08L71/02C09K5/14
CPCC08K2003/265C08K2201/011C08L61/06C08L63/00C08L67/06C09K5/14C08L39/06C08K9/04C08K3/042C08K3/041C08K7/00C08K9/06C08K3/26C08L29/04C08K7/06C08K7/14C08L71/02C08K9/08
Inventor 黄卫明赵立平林丽萍孙东升张炳德林建斌
Owner XIAMEN KNANO GRAPHENE TECH CORP
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