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Surface treatment method of silver evaporating material

A surface treatment and drying technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of high preparation cost of silver evaporation material, and achieve the effect of improving production environment, improving purity and reducing consumption

Inactive Publication Date: 2018-12-11
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] The silver evaporation material used for semiconductor integrated circuits is an indispensable raw material for wafer back gold technology, but the preparation cost of silver evaporation material in the prior art is relatively high

Method used

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  • Surface treatment method of silver evaporating material
  • Surface treatment method of silver evaporating material
  • Surface treatment method of silver evaporating material

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Embodiment Construction

[0030] It can be seen from the background art that the preparation cost of silver evaporation material is relatively high. The reasons for the higher preparation cost of analyzing silver evaporated material are:

[0031] In order to remove the oxide layer on the surface of the silver evaporation material and improve the purity of the silver evaporation material, the surface treatment method of the silver evaporation material mainly includes pickling, cleaning and drying in sequence. However, the pickling solution used in the pickling operation is easy to consume silver material, thereby causing the loss of the silver evaporation material, which correspondingly increases the preparation cost of the silver evaporation material; and the use of acid is not conducive to the production environment. improve.

[0032] In order to solve the technical problem, the present invention carries out centrifugal grinding operation on the silver evaporation material to remove the oxide layer o...

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Abstract

The invention provides a surface treatment method of silver evaporating material, comprising: providing silver evaporating material; Performing a centrifugal grinding operation on the silver evaporating material; Performing a cleaning operation on the silver evaporating material after the centrifugal grinding operation; Drying the silver evaporating material after the cleaning operation. A centrifugal grin operation is performed on that sil evaporating material, to remove an oxide layer on the surface of the silver vaporizer, so that that effect of surface polis is achieved, compared to a scheme employing an acid pickling operation to remove an oxide layer, The invention can avoid the problem that the pickling solution consumes the silver evaporating material, thereby improving the surfacebrightness and smoothness of the silver evaporating material, improving the purity of the silver evaporating material, reducing the consumption of the silver evaporating material, and further reducing the preparation cost of the silver evaporating material.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a surface treatment method for silver evaporation material. Background technique [0002] Physical vapor deposition (Physical Vapor Deposition, PVD) is a low-voltage, high-current arc discharge technology under vacuum conditions, using gas discharge to evaporate the target material or evaporation material and ionize both the evaporated material and the gas. Using the acceleration of the electric field, the evaporated substance and reactant are deposited on the substrate. At present, PVD technology has become the core technology of various industries such as semiconductor chip manufacturing industry, solar energy industry, and LCD (Liquid Crystal Display, liquid crystal display) manufacturing industry. [0003] PVD technology mainly includes sputtering technology and evaporation coating technology. Among them, in a vacuum environment, the technology of heating and evap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/3205
CPCH01L21/32051
Inventor 姚力军潘杰相原俊夫王学泽罗明浩曹欢欢
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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