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Thermal conductive aluminum alloy, and preparation method and application thereof

An aluminum alloy and mixed rare earth technology, which is applied in the field of heat-conducting aluminum alloy and its preparation, can solve the problems of unsatisfactory thermal conductivity, low hardness of pure aluminum, and easy deformation.

Inactive Publication Date: 2018-12-18
GUANGXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among aluminum alloy materials, pure aluminum has a high thermal conductivity, up to 220-235W / m K, but pure aluminum has low hardness and is easy to deform, so it is difficult to be directly used as a heat dissipation material; aluminum alloys, such as 6063 aluminum alloys, have medium strength And good processing performance, it has become the main material for the preparation of electronic devices on the market, such as computer CPU heat sinks
Although 6063 aluminum alloy can be used as a heat dissipation material, the thermal conductivity of the material is not ideal

Method used

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  • Thermal conductive aluminum alloy, and preparation method and application thereof
  • Thermal conductive aluminum alloy, and preparation method and application thereof
  • Thermal conductive aluminum alloy, and preparation method and application thereof

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preparation example Construction

[0033] The present invention provides a method for preparing a heat-conducting aluminum alloy described in the above technical solution, comprising the following steps:

[0034] (1) Melting the raw materials including the corresponding components of the heat-conducting aluminum alloy described in the above technical solution to obtain the aluminum alloy liquid;

[0035] (2) casting the aluminum alloy liquid obtained in the step (1), and obtaining an ingot after cooling;

[0036] (3) performing solution treatment on the ingot obtained in the step (2) to obtain a homogenized aluminum alloy; the temperature of the solution treatment is 510-560° C., and the holding time of the solution treatment is 6-8 hours;

[0037] (4) Extruding the homogenized aluminum alloy obtained in the step (3) to obtain an extruded material; the temperature of the extrusion is 380-420°C; the extrusion ratio of the extrusion is 45-55;

[0038] (5) aging the extruded material obtained in the step (4) to o...

Embodiment 1

[0071] Prepare the raw materials according to the contents shown in Table 1, and then prepare the heat-conducting aluminum alloy in the following manner: Among them, the auxiliary agent used in the smelting process is: refining agent C 2 Cl 6 , the amount added is 0.3% of the mass of molten aluminum; the covering agent is: 55% NaCl+45% KCl, the amount added is 0.3% of the mass of molten aluminum; the coating is: ZnO: 20%, Na 2 SiO 3 :10%, H 2 O margin.

[0072] Add industrial pure aluminum into the graphite crucible, heat until the pure aluminum melts, then add the aluminum-silicon master alloy ingot, after the aluminum-silicon master alloy is melted, add a covering agent to protect the melt, continue heating; stir the melt to make the temperature uniform, When the temperature reaches 730°C, press the aluminum-boron intermediate alloy into the molten aluminum with a carbon cover, stir at a slow speed for 5 minutes, add the covering agent, adjust the temperature to 730°C and...

Embodiment 2～6

[0076] The thermally conductive aluminum alloy was prepared according to the method of Example 1, the difference lies in the composition and the specific preparation process, which are listed in Tables 1 and 2.

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Abstract

The invention belongs to the technical field of metal material heat conduction, in particular to thermal conductive aluminum alloy, and a preparation method and application thereof. According to the invention, mixed rare earth and boron refined alloy grains are utilized to reduce the content of harmful trace elements in the alloy, so that the aluminum alloy has excellent thermal conductivity underthe premise of high strength and plasticity. Embodiment results show that the aluminum alloy provided by the invention has a thermal conductivity of 236 W / m*K or more and a tensile strength of 199 MPa or more, and can be used as a heat dissipating material for electronic devices.

Description

technical field [0001] The invention belongs to the technical field of metal heat-conducting materials, and in particular relates to a heat-conducting aluminum alloy and a preparation method and application thereof. Background technique [0002] A large amount of heat is generated during the operation of electronic devices. If the heat is not dissipated in time, the performance of electronic devices will inevitably be affected if they operate under high temperature conditions for a long time. At present, electronic devices are constantly developing in the direction of light weight, large capacity, and high-speed operation. The calculation speed of internal core devices is getting faster and faster, resulting in a significant increase in heat generation, which puts higher demands on the thermal conductivity of materials. requirements. [0003] Aluminum alloy has many advantages such as good thermal conductivity, mechanical properties, wide source, and low price, and has beco...

Claims

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Application Information

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IPC IPC(8): C22C21/08C22C1/03C22F1/047C22C1/06
CPCC22C21/08C22C1/026C22C1/03C22C1/06C22F1/047
Inventor 赵艳君胡治流黄雅莹李逸泰庞兴志唐鹏米沥王珺俊
Owner GUANGXI UNIV
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