A bound single-target sputtering preparation of Cu 3 sns 4 method of absorbing layer
An absorption layer and sputtering technology, which is applied in the field of Cu3SnS4 absorption layer prepared by sputtering with a single target, can solve the problems of target reduction, poor conductivity, target discharge, etc. And the effect of uniform composition and fast sputtering speed
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Embodiment 1
[0026] Example 1: Preparation of Cu by sputtering with a bound single target 3 SnS 4 The method of absorbing layer, concrete steps are:
[0027] (1) Substrate pretreatment: The soda-lime glass substrate is ultrasonically cleaned with acetone, absolute ethanol, and deionized water in sequence, and the cleaned substrate is dried with nitrogen gas, and placed on a substrate rack filled with absolute ethanol For use, blow dry the substrate with nitrogen;
[0028] (2) Place the pretreated substrate in step (1) on the sample holder in the magnetron sputtering chamber, install the ternary copper-tin-sulfur target bound to the pure copper target in the magnetron sputtering chamber, adjust the binding The target base distance between the ternary copper-tin-sulfur target of the pure copper target and the substrate in the sputtering chamber is 80 mm; the ternary copper-tin-sulfur target bound to the pure copper target is the ternary copper-tin-sulfur target through The indium material...
Embodiment 2
[0033] Example 2: Preparation of Cu by sputtering with a single bound target 3 SnS 4 The method of absorbing layer, concrete steps are:
[0034] (1) Substrate pretreatment: The soda-lime glass substrate is ultrasonically cleaned with acetone, absolute ethanol, and deionized water in sequence, and the cleaned substrate is dried with nitrogen gas, and placed on a substrate rack filled with absolute ethanol For use, blow dry the substrate with nitrogen;
[0035] (2) Place the pretreated substrate in step (1) on the sample holder in the magnetron sputtering chamber, install the ternary copper-tin-sulfur target bound to the pure copper target in the magnetron sputtering chamber, adjust the binding The target base distance between the ternary copper-tin-sulfur target of the pure copper target and the substrate in the sputtering chamber is 85 mm; the ternary copper-tin-sulfur target bound to the pure copper target is the ternary copper-tin-sulfur target through The indium material...
Embodiment 3
[0042] Example 3: Preparation of Cu by sputtering with a bound single target 3 SnS 4 The method of absorbing layer, concrete steps are:
[0043] (1) Substrate pretreatment: The soda-lime glass substrate is ultrasonically cleaned with acetone, absolute ethanol, and deionized water in sequence, and the cleaned substrate is dried with nitrogen gas, and placed on a substrate rack filled with absolute ethanol For use, blow dry the substrate with nitrogen;
[0044] (2) Place the pretreated substrate in step (1) on the sample holder in the magnetron sputtering chamber, install the ternary copper-tin-sulfur target bound to the pure copper target in the magnetron sputtering chamber, adjust the binding The target base distance between the ternary copper-tin-sulfur target of the pure copper target and the substrate in the sputtering chamber is 90 mm; the ternary copper-tin-sulfur target bound to the pure copper target is the ternary copper-tin-sulfur target through The indium material...
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