Supercharge Your Innovation With Domain-Expert AI Agents!

Epoxy resin composition and electronic component device

A technology of epoxy resin and composition, which is applied in the field of epoxy resin composition and electronic components and devices, can solve the problems of packaging cracks and poor electrical characteristics, and achieve the effects of excellent reflow soldering resistance and good flame retardancy

Active Publication Date: 2022-04-08
RESONAC CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, surface mount type ICs are temporarily fixed on the surface of the wiring board, and then processed with a solder bath, reflow soldering equipment, etc., so they are directly exposed to the soldering temperature (reflow soldering temperature)
As a result, when the package absorbs moisture, the absorbed moisture vaporizes during reflow, and the generated vapor pressure acts as peeling stress, causing peeling between interposers such as components and lead frames and the sealing material, resulting in Causes of package cracks and poor electrical characteristics

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy resin composition and electronic component device
  • Epoxy resin composition and electronic component device
  • Epoxy resin composition and electronic component device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0198]

[0199] The epoxy resin composition may be prepared by any method as long as various raw materials can be uniformly dispersed and mixed. As a general preparation method, the following method can be cited: After fully mixing the raw materials in a predetermined amount with a mixer, etc., they are mixed or melt-kneaded with a grinding roll, extruder, crushing machine, planetary mixer, etc., and cooled. , Degassing and pulverization as needed. In addition, the epoxy resin composition can also be made into small pieces (Japanese: tablet) with a size and quality that meet the molding conditions as needed.

[0200]

[0201] An electronic component device according to one embodiment of the present invention includes an element and a cured product of the epoxy resin composition that seals the element. As a method of sealing an element using the epoxy resin composition of the present embodiment as a sealing material, low-pressure transfer molding is generally used, but inj...

Embodiment

[0206] Next, the present invention will be described using synthesis examples and examples, but the scope of the present invention is not limited to these examples.

Synthetic example 1～4

[0208] Specific epoxy resins can be synthesized as follows.

[0209] First, a raw material phenol novolak resin and a raw material benzyl group-containing compound are reacted using p-toluenesulfonic acid as an acid catalyst to obtain a specific phenol novolac resin. At this time, the hydroxyl equivalent is measured in the same manner as the method for measuring the hydroxyl equivalent in the curing agent described above, and the value of p in the general formula (1) is obtained from this value.

[0210] Next, the specific phenol novolak resin obtained above was epoxidized with epichlorohydrin. The epoxy equivalent, softening point, and melt viscosity at 150° C. of the obtained resin are shown in Table 1 below. It should be noted that in the specific epoxy resin obtained, R in the general formula (1) 2 is benzyl (R 3 to a hydrogen atom).

[0211] [Table 1]

[0212]

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
epoxy equivalentaaaaaaaaaa
epoxy equivalentaaaaaaaaaa
softening pointaaaaaaaaaa
Login to View More

Abstract

An epoxy resin composition, it contains: epoxy resin, comprises the compound shown in following general formula (1); And curing agent, comprises and is selected from biphenylene type phenol aralkyl resin, phenol aralkyl resin and at least one of triphenylmethane-type phenolic resins. R 1 Each independently represents a hydrogen atom or a monovalent hydrocarbon group with 1 to 6 carbon atoms, and R 2 Represents the substituent shown in formula (a), m represents the value from 0 to 20, p represents 0.5 to 2.0, R 3 Each independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Description

technical field [0001] The present invention relates to an epoxy resin composition and an electronic component device. Background technique [0002] In recent years, high-density mounting of semiconductor elements has progressed. Accordingly, the mainstream of resin-sealed semiconductor devices has shifted from conventional pin insertion type packages to surface mount type packages. In order to increase the mounting density and reduce the mounting height, surface-mount ICs (Integrated Circuits), LSIs (Large Scale Integration), and the like have become thin and small packages. Therefore, the area occupied by the element with respect to the package becomes large, and the thickness of the package becomes very thin. [0003] In addition, the mounting method of these packages is different from that of the conventional pin insertion type packages. That is, the pin insertion type package is soldered from the back surface of the wiring board after the pins are inserted into the w...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/62C08G59/32
CPCC08G59/32C08G59/62C08K3/013C08G59/3218C08G59/621C08L63/00
Inventor 石黑正马场彻
Owner RESONAC CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com