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Polyimide precursor solution and method for producing same

A polyimide precursor, polyimide technology, applied in the direction of coating, etc., can solve the problems of reducing thermal expansion coefficient, low thermal expansion coefficient, and inability to reach plastic substrates, so as to improve efficiency, increase uniformity and yield Excellent efficiency, mechanical strength and flexibility

Active Publication Date: 2018-12-21
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, even though polyimide is a high-performance polymer material with high thermal stability, mechanical properties, chemical resistance and electrical properties, it cannot satisfy the colorless and transparent properties that are the basic elements used in the display field. properties, and there is a need to further reduce the thermal expansion coefficient
For example, the thermal expansion coefficient of Kapton sold by DuPont is about 30ppm / °C, showing a low thermal expansion coefficient value, but this cannot meet the conditions required for plastic substrates

Method used

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  • Polyimide precursor solution and method for producing same
  • Polyimide precursor solution and method for producing same
  • Polyimide precursor solution and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0151] TFMB(0.99) / PMDA(0.85)_6FDA(0.15)

[0152] In a stirrer with nitrogen flow, 100g of N,N-diethylacetamide (N,N-diethylacetamide) (DEAc) (distribution coefficient 0.32, density 0.9130g / cm 3 ), in a state where the temperature of the reactor was maintained at 25°C, 12 g of TFMB (2,2'-bis(trifluoromethyl)-4,4'-biphenylenediamine, 2,2` -bis(trifluoromethyl)-4,4`-biphenyl diamine). In the above TFMB solution, 7 g of PMDA (pyromellitic dianhydride, Pyromellitic Dianhydride) and 2.5 g of 6FDA (4,4'-(hexafluoroisopropylidene) diphthalic anhydride, 4,4 '-(Hexafluoroisopropylidene)diphthalic anhydride) was added at the same temperature, dissolved for a certain period of time and stirred. DEAc was added so that the solid content density|concentration of the polyimide precursor solution manufactured by the said reaction might become 10-10.5 weight%, and the polyimide precursor solution was manufactured. The viscosity of the said polyimide precursor solution was 6300cp.

Embodiment 2

[0153] TFMB(0.99) / PMDA(0.80)_6FDA(0.20)

[0154] 100 g of N,N-diethylacetamide (DEAc) was placed in a stirrer with nitrogen flow, and 12.7 g was dissolved while maintaining the temperature of the reactor at 25°C. TFMB (2,2'-bis(trifluoromethyl)-4,4'-biphenyldiamine, 2,2`-bis(trifluoromethyl)-4,4`-biphenyldiamine). In the above TFMB solution, 7g of PMDA (pyromellitic dianhydride, Pyromellitic Dianhydride) and 3.56g of 6FDA (4,4'-(hexafluoroisopropylidene) diphthalic anhydride, 4,4 '-(Hexafluoroisopropylidene)diphthalic anhydride) was added at the same temperature, dissolved for a certain period of time and stirred. DEAc was added so that the solid content density|concentration of the polyimide precursor solution manufactured by the said reaction might become 10-10.5 weight%, and the polyimide precursor solution was manufactured. The viscosity of the said polyimide precursor solution was 6800cp.

Embodiment 3

[0155] TFMB(0.99) / PMDA(0.75)_6FDA(0.25)

[0156]100 g of N,N-diethylacetamide (N,N-diethylacetamide) (DEAc) was placed in a stirrer with a nitrogen gas flow, and dissolved while maintaining the temperature of the reactor at 25°C. 13.56 g of TFMB (2,2'-bis(trifluoromethyl)-4,4'-biphenyldiamine, 2,2'-bis(trifluoromethyl)-4,4'-biphenyldiamine). In the above TFMB solution, 7g of PMDA (pyromellitic dianhydride, Pyromellitic Dianhydride) and 4.75g of 6FDA (4,4'-(hexafluoroisopropylidene) diphthalic anhydride, 4,4 '-(Hexafluoroisopropylidene)diphthalic anhydride) was added at the same temperature, dissolved for a certain period of time and stirred. DEAc was added so that the solid content density|concentration of the polyimide precursor solution manufactured by the said reaction might become 10-10.5 weight%, and the polyimide precursor solution was manufactured. The viscosity of the said polyimide precursor solution was 6200cp.

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Abstract

The present invention provides a polyimide precursor solution which can enhance the uniformity of a polyimide film and also improve the efficiency of processes by improving liquid curl in a coating process of the polyimide precursor solution. In addition, since polyimide according to the present invention has excellent transparency, heat resistance, mechanical strength and flexibility by comprising a specific structure, the polyimide may be used in various fields, such as substrates for devices, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, flexible printed circuits (FPCs), tapes, touch panels, protective films for optical discs, etc.

Description

technical field [0001] This application claims priority based on Korean Application No. 2016-0094851 dated 2016.07.26 and Korean Application No. 2017-0080993 dated 2016.06.27. The entire content disclosed in the literature of the Korean patent application is included as a part of this specification. [0002] The present invention provides liquid dewetting of solutions when coated on substrates A polyimide precursor solution with improved properties. Background technique [0003] Polyimide (polyimide, PI) is a polymer with relatively low crystallinity or mostly non-crystalline structure. It not only has the advantages of easy synthesis, thin film membrane and no need for crosslinking groups for curing. Moreover, polymer materials with excellent heat resistance and chemical resistance, excellent mechanical properties, electrical properties and dimensional stability brought about by transparency and rigid chain structure are currently used as automobiles, aerospace fields, fl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18C08K5/5415
CPCC08J5/18C09D179/08C08G73/1039C08G73/1042C08G73/1067C08J2379/08C08K5/5477C08G73/1007C08G73/106C08L79/085C08K5/5415C08L79/08
Inventor 尹哲民金璟晙
Owner LG CHEM LTD
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