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Polyimide precursor solution and manufacturing method thereof

一种聚酰亚胺前体、聚酰亚胺膜的技术，应用在涂层等方向，能够解决降低热膨胀系数、低热膨胀系数、无法达到塑料基板等问题，达到提高均匀度和收率、改善效率性、机械强度和柔韧性优异的效果

Active Publication Date: 2020-11-13
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, even though polyimide is a high-performance polymer material with high thermal stability, mechanical properties, chemical resistance and electrical properties, it cannot satisfy the colorless and transparent properties that are the basic elements used in the display field. properties, and there is a need to further reduce the thermal expansion coefficient
For example, the thermal expansion coefficient of Kapton sold by DuPont is about 30ppm / °C, showing a low thermal expansion coefficient value, but this cannot meet the conditions required for plastic substrates

Method used

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  • Polyimide precursor solution and manufacturing method thereof
  • Polyimide precursor solution and manufacturing method thereof
  • Polyimide precursor solution and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0151] TFMB(0.99) / PMDA(0.85)_6FDA(0.15)

[0152] In a stirrer with nitrogen flow, 100g of N,N-diethylacetamide (N,N-diethylacetamide) (DEAc) (distribution coefficient 0.32, density 0.9130g / cm 3 ), in a state where the temperature of the reactor was maintained at 25°C, 12 g of TFMB (2,2'-bis(trifluoromethyl)-4,4'-biphenylenediamine, 2,2` -bis(trifluoromethyl)-4,4`-biphenyl diamine). In the above TFMB solution, 7 g of PMDA (pyromellitic dianhydride, Pyromellitic Dianhydride) and 2.5 g of 6FDA (4,4'-(hexafluoroisopropylidene) diphthalic anhydride, 4,4 '-(Hexafluoroisopropylidene)diphthalic anhydride) was added at the same temperature, dissolved for a certain period of time and stirred. DEAc was added so that the solid content density|concentration of the polyimide precursor solution manufactured by the said reaction might become 10-10.5 weight%, and the polyimide precursor solution was manufactured. The viscosity of the said polyimide precursor solution was 6300cp.

Embodiment 2

[0153] TFMB(0.99) / PMDA(0.80)_6FDA(0.20)

[0154] 100 g of N,N-diethylacetamide (DEAc) was placed in a stirrer with nitrogen flow, and 12.7 g was dissolved while maintaining the temperature of the reactor at 25°C. TFMB (2,2'-bis(trifluoromethyl)-4,4'-biphenyldiamine, 2,2`-bis(trifluoromethyl)-4,4`-biphenyldiamine). In the above TFMB solution, 7g of PMDA (pyromellitic dianhydride, Pyromellitic Dianhydride) and 3.56g of 6FDA (4,4'-(hexafluoroisopropylidene) diphthalic anhydride, 4,4 '-(Hexafluoroisopropylidene)diphthalic anhydride) was added at the same temperature, dissolved for a certain period of time and stirred. DEAc was added so that the solid content density|concentration of the polyimide precursor solution manufactured by the said reaction might become 10-10.5 weight%, and the polyimide precursor solution was manufactured. The viscosity of the said polyimide precursor solution was 6800cp.

Embodiment 3

[0155] TFMB(0.99) / PMDA(0.75)_6FDA(0.25)

[0156]100 g of N,N-diethylacetamide (N,N-diethylacetamide) (DEAc) was placed in a stirrer with a nitrogen gas flow, and dissolved while maintaining the temperature of the reactor at 25°C. 13.56 g of TFMB (2,2'-bis(trifluoromethyl)-4,4'-biphenyldiamine, 2,2'-bis(trifluoromethyl)-4,4'-biphenyldiamine). In the above TFMB solution, 7g of PMDA (pyromellitic dianhydride, Pyromellitic Dianhydride) and 4.75g of 6FDA (4,4'-(hexafluoroisopropylidene) diphthalic anhydride, 4,4 '-(Hexafluoroisopropylidene)diphthalic anhydride) was added at the same temperature, dissolved for a certain period of time and stirred. DEAc was added so that the solid content density|concentration of the polyimide precursor solution manufactured by the said reaction might become 10-10.5 weight%, and the polyimide precursor solution was manufactured. The viscosity of the said polyimide precursor solution was 6200cp.

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Abstract

The invention provides a polyimide precursor solution, which can not only improve the uniformity of the polyimide film, but also improve the liquid dewetting problem in the coating process of the polyimide precursor solution. Improve process efficiency. In addition, the polyimide according to the present invention is excellent in transparency, heat resistance, mechanical strength and flexibility by including a specific structure, and can be used in substrates for components, cover substrates for displays, optical films, IC (integrated circuits, Integrated circuit) package, adhesive film (adhesive film), multilayer FPC (flexible printed circuit, flexible printed circuit), adhesive tape, touch panel, protective film for optical discs, etc. are used in various fields.

Description

technical field [0001] This application claims priority based on Korean Application No. 2016-0094851 dated 2016.07.26 and Korean Application No. 2017-0080993 dated 2016.06.27. The entire content disclosed in the literature of the Korean patent application is included as a part of this specification. [0002] The present invention provides liquid dewetting of solutions when coated on substrates A polyimide precursor solution with improved properties. Background technique [0003] Polyimide (polyimide, PI) is a polymer with relatively low crystallinity or mostly non-crystalline structure. It not only has the advantages of easy synthesis, thin film membrane and no need for crosslinking groups for curing. Moreover, polymer materials with excellent heat resistance and chemical resistance, excellent mechanical properties, electrical properties and dimensional stability brought about by transparency and rigid chain structure are currently used as automobiles, aerospace fields, fl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18C08K5/5415
CPCC08J5/18C09D179/08C08G73/1039C08G73/1042C08G73/1067C08J2379/08C08K5/5477C08G73/1007C08G73/106C08L79/085C08K5/5415C08L79/08
Inventor 尹哲民金璟晙
Owner LG CHEM LTD
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