Cu-Ni-Si COPPER ALLOY SHEET AND MANUFACTURING METHOD

一种铜合金、板材的技术，应用在金属轧制等方向，能够解决蚀刻面表面平滑性得不到能够满足需要等问题，达到尺寸精度优异的效果

Active Publication Date: 2018-12-21
DOWA METALTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to manufacture such a high-definition lead frame with high dimensional accuracy, satisfactory results cannot be obtained in terms of surface smoothness of the etched surface.
In addition, there is room for improvement in the shape of the sheet material used as raw material

Method used

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  • Cu-Ni-Si COPPER ALLOY SHEET AND MANUFACTURING METHOD

Examples

Experimental program
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Effect test

Embodiment

[0096] Copper alloys having the chemical compositions shown in Table 1 were melted and cast using a vertical semi-continuous casting machine. The obtained slab was heated at 1000° C. for 3 hours, extracted, hot-rolled to a thickness of 14 mm, and cooled with water. The total hot rolling ratio is 90 to 95%. After the hot rolling, the oxide layer on the surface layer was removed by mechanical grinding (face grinding), and 80 to 98% cold rolling was performed to obtain an intermediate product plate for melt treatment. Under the conditions shown in Table 2 and Table 3, each intermediate product plate was subjected to melt treatment, intermediate cold rolling, aging treatment, final cold rolling, shape correction with a tension temper, and low-temperature annealing. In some comparative examples (No. 34), 90% cold rolling was performed on the face-cut sheet material after hot rolling, and this was subjected to solution treatment as an intermediate product sheet material, and the in...

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Abstract

The invention provides a high strength Cu-Ni-Si copper alloy sheet with excellent surface smoothness of the etching surface. The copper alloy sheet having a composition made, in mass%, of Ni: 1.0-4.5%, Si: 0.1-1.2%, Mg:0-0.3%, Cr: 0-0.2%, Co: 0-2.0%, P: 0-0.1%, B: 0-0.05%, Mn: 0-0.2%, Sn: 0-0.5%, Ti: 0-0.5%, Zr: 0-0.2%, Al: 0-0.2%, Fe: 0-0.3%, and Zn: 0-1.0%, the balance being Cu and unavoidable impurities. In an observation plane parallel to the sheet surface, the number density of coarse second phase particles with a major axis of at least 1.0 [mu]m is 4.0 * 10<3> / mm2 or less and the KAM value in crystal grains measured by EBSD with a step size of 0.5 [mu]m when boundaries with crystal misorientations of at least 15 DEG are considered to be crystal grain boundaries is greater than 3.00.

Description

technical field [0001] The present invention relates to a high-strength Cu-Ni-Si-based copper alloy plate material suitable as a raw material for a lead frame for forming narrow-width, high-precision pins by photolithography, and a manufacturing method thereof. The "Cu-Ni-Si-based copper alloy" referred to in this specification also includes Cu-Ni-Si-based copper alloys of the type to which Co is added. Background technique [0002] In order to produce a high-definition lead frame, precise etching on the order of 10 μm is required. In order to form leads with good linearity by such precise etching, it is required to obtain a raw material having an etched surface with as few surface irregularities as possible (good surface smoothness). In addition, in order to cope with the miniaturization and thinning of semiconductor packages, it is also required to reduce the diameter of the leads of the lead frame. In order to reduce the diameter of leads, it is important to increase th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22C9/10C22F1/08
CPCC22C9/10C22F1/08C22C9/06B21B2003/005B21D1/10C22C2200/00C22C2202/00
Inventor 首藤俊也须田久佐佐木史明
Owner DOWA METALTECH CO LTD
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