A fractal geometry micro-channel heat dissipation device

Abstract

The invention discloses a fractal geometry micro-channel heat dissipation device, comprising a heat dissipation plate, a water pump and a fluid injection pipe and a fluid return pipe connecting the heat dissipation plate and the water pump, wherein the heat dissipation plate is composed of an upper circuit substrate and a lower micro-channel substrate, and the micro-channel substrate is provided with a fractal geometry micro-channel structure. The fractal geometry micro-channel heat dissipation structure has high heat dissipation efficiency and low noise, and micro-channel structure is easy tomachine, and the packaging space is saved, which is conducive to high integration characteristics; curved channels of the fractal geometry micro-channel structure can improve the heat exchange process between fluid and wall, and fractal geometry micro-channels are uniformly distributed on the micro-channel substrate layer, which can dissipate heat uniformly and sufficiently, and effectively solvethe problem of temperature non-uniformity.

Description

technical field [0001] The invention relates to heat dissipation technology, in particular to a fractal geometry microchannel heat dissipation device, which can be used for heat dissipation of electronic components with high heat flux density. Background technique [0002] With the increasing demand for more functions, smaller size and higher integration of electronic products such as smart phones, tablet computers, mobile storage devices and automotive electronic devices. System on Chip (SOC) is to integrate a complete system on a single chip, including central processing unit, memory, and peripheral circuits, etc., and the packaging system (SIP) tool will seal the chip with certain functions in a shell that is suitable for it. In the body, these two technologies have also been continuously improved, and the functions and function densities realized by microelectronic chips have increased exponentially. With the increase of functions, its power consumption and heat generat...

AI Technical Summary

Problems solved by technology

There are many heat dissipation technologies, and different heat sources also have different heat dissipation technologies. There is natural air cooling, which can be used for heat dissipation of heat sources at low heat flux; forced air cooling technology, compared with natural cooling, strengthens convection in the air The thermal process speeds up the heat dissipation performance, but the relative noise is relatively large, and the heat dissipation effect is not high; the water-cooled heat dissipation method has a strong heat transfer capacity and low noise, and can be used for heat dissipation of heat sources with high heat flux density; there is also thermoelectric cooling and heat dissipation technology, through two After the terminal voltage difference forms a current, the heat will also be transferred to form a heat difference, and then achieve the heat dissipation effect. This heat dissipation technology requires relatively high reliability and requires a certain amount of energy consumption.

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