High-toughness epoxy resin composite material with microcosmic polymer nanostructures

A technology of epoxy resin and composite materials, applied in the field of polymer composite materials, can solve problems such as difficulty in meeting the use requirements, insufficient toughness of EP cured products, and large internal stress

Pending Publication Date: 2019-01-04
SICHUAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the cured product formed after EP curing has a high crosslinking density, a three-dimensional network structure in space, difficult sliding between molecular chains, and large internal stress, resulting in hard and brittle cured products, easy ...

Method used

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  • High-toughness epoxy resin composite material with microcosmic polymer nanostructures
  • High-toughness epoxy resin composite material with microcosmic polymer nanostructures
  • High-toughness epoxy resin composite material with microcosmic polymer nanostructures

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Embodiment 1

[0037] Embodiment 1, preparation and performance detection of the composite material of the present invention

[0038] One, the preparation of composite material of the present invention

[0039] 1. Experimental materials and reagents

[0040] Bisphenol A glycidyl ether epoxy resin E-51 (DGEBA), purchased from Jiangsu Wuxi Resin Factory;

[0041] 3,3'-dichloro-4,4'-diaminodiphenylmethane (MOCA), purchased from Changshan Bell Co., Ltd.;

[0042] Monohydroxyl-terminated polydimethylsiloxane (PDMS-OH) was provided by Shin-Etsu Chemical Co., Ltd., Japan. Adopt anhydrous toluene azeotropic distillation before use;

[0043]ε-caprolactone (ε-CL), purchased from Aladdin, 99%, treated with calcium hydride (CaH 2 ) after drying, distillation under reduced pressure;

[0044] Stannous octoate (Sn(Oct) 2 ), purchased from Aladdin.

[0045] 2. Synthesis of Diblock Copolymer PDMS-b-PCL

[0046]

[0047] Add the polydimethylsiloxane PDMS-OH and caprolactone monomer and 0.1%wt stann...

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Abstract

The invention provides a high-toughness epoxy resin composite material with microcosmic polymer nanostructures. The high-toughness epoxy resin composite material is prepared by, by weight, 40-60 partsof epoxy resin, 0.01-16 parts of diblock copolymer and 16-23 parts of curing agent. Experiment results show that compared with pure epoxy resin, the PDMS-PCL/EP composite material prepared by the method has evidently enhanced toughness; when PDMS1-PCL4 content is 40wt%, the fracture toughness of the thermosetting material with 10-60nm wormlike nanostructures is increased by about 255% as comparedwith that of the pure epoxy resin, and the fracture toughness of the thermosetting material added with the same quantity of spherical nanostructures is only increased by 42% as compared with that ofthe pure epoxy resin; compared with a PCL-b-PDMS-b-PCL-EP composite material, under the same adding quantity, the toughness of the PDMS-PCL/EP composite material prepared by the method is evidently better than that of the PCL-b-PDMS-b-PCL-EP composite material, and the toughness is increased by 97%. The toughness of the PDMS-PCL/EP composite material prepared by the method according to a specificproportion has evident advantages, an unexpected technological effect is obtained, and the application range of the epoxy resin is expanded.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, in particular to a high-toughness epoxy resin composite material with a polymer nanostructure on the microscopic scale. Background technique [0002] Epoxy resin (EP) is an excellent high-strength thermosetting resin and is a widely used matrix material. EP molecules have two or more epoxy groups, which can be cross-linked and cured with amines, acid anhydrides, and polyamides to form a highly cross-linked three-dimensional network structure, and the cured product has wear resistance Good, excellent heat resistance, good chemical stability, excellent electrical insulation, high strength, low shrinkage, easy processing and molding, chemical resistance, good adhesion to substrates and low price, etc., as an electronic coating , coatings, electrical materials, casting packaging materials, adhesives, and sealant matrix resins are widely used in various fields of the national economy such a...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L83/10
CPCC08L63/00C08L83/10
Inventor 邹华维陈洋衡正光李霂萱张浩若梁梅
Owner SICHUAN UNIV
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