One-piece Inductor Forming Method

Abstract

A method for forming integrally formed inductance include such steps as placing coil, SMD pin, iron powder with thermosetting adhesive and couple agent in mold cavity of cold forming mold, preformingand cold pressing at pressure of 1. 8-2.5 T / cm<2>, and fixing coil in iron powder to obtain semi-finished product, mixing that coil, SMD pin, thermosetting adhesive and coupling agent, and pressing. 2, heat that thermoforming die to a preheat temperature, wherein the preheating temperature is higher than a softening temperature which softens the thermosetting bind and makes the relative displacement of the iron powder particles easy; 3, that semi-finished product is place in an inductance accommodating hole arrange in the thermoforming die, and the SMD pin accommodating hole is heated to a softening temperature; 3, hot press that semi-finished product place in the inductance accommodating hole and the SMD pin accommodating hole with the heat curing pressure, and heating to the heat curingtemperature of the thermosetting adhesive so as to solidify the thermosetting adhesive and keep the pressure, thereby completing the integral molding inductance molding. A low molding pressure of thatintegrally formed inductance molding method and good insulation between layers of the coil are obtained.

Description

technical field [0001] The invention relates to the field of production of electronic components, in particular to an integrally formed inductor forming method. Background technique [0002] Compared with traditional assembled inductors, one-piece molded inductors (molded inductors) can maintain excellent temperature rise current and saturation current characteristics in high frequency and high temperature environments due to their low impedance, low parasitic capacitance, small volume, and high current. , is widely used in consumer, industrial, and automotive electronic equipment; the integrally formed inductor includes a seat body and a winding body, and the seat system is formed by die-casting the winding body embedded in iron powder, and the SMD pin is the winding body The lead-out pins are directly formed on the surface of the seat body; increasing the density of the iron powder in the one-piece molded inductor to 5.7g / cm2 can improve the performance of the one-piece mo...

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Problems solved by technology

[0003] The purpose of the present invention is to overcome the current process of one-time cold pressing and then heating and curing in order to overcome the current integrated inductor. During the mixing process of epoxy resin and magnetic powder, the epoxy resin coated in magnetic powder completes the first stage The solidification has a certain hardness, and the cold forming pressure is very high (6~7t / cm2), which leads to high cost of the press, and the coil wrapped in the powder is easy to be deformed or punctured by the iron powder, resulting in Insufficient insulation between coil layers provides a low molding pressure to reduce the cost of the press, the coil wrapped in the powder will not be deformed or pierced by the iron powder, and the coil layer insulation is good. Forming method

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