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Preparation method of high-performance phenolic hollow microspheres

A hollow microsphere, high-performance technology, applied in the field of preparation of high-performance phenolic hollow microspheres, can solve the problem of poor controllability of morphology, ineffective control methods for improving the size and stacking performance of hollow spheres that control the breaking rate, It is difficult to realize problems such as batch preparation and achieve the effect of regular roundness

Active Publication Date: 2020-12-15
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] All of the above methods have problems such as complicated process, poor shape controllability, and difficulty in batch preparation, and there is no effective improvement control method in controlling the breaking rate, size and stacking performance of hollow balls.

Method used

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  • Preparation method of high-performance phenolic hollow microspheres

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The preparation method of embodiment 1 phenolic hollow microspheres X1

[0032] Select the water-soluble thermosetting phenolic resin with a solid content of 40% and a viscosity of 1000 centipoise as one of the raw materials, and mix the water-soluble thermosetting phenolic resin with a weight ratio of 100:1:2: foaming agent: surfactant Stir evenly, add water to obtain a precursor material of phenolic hollow microspheres with a viscosity of 400 centipoise. Wherein the foaming agent is selected as foaming agent H, and the surfactant is selected as BD-3088 (belonging to organosilane surfactants). The prepared phenolic hollow microsphere precursor material is atomized into fine droplets through a sprayer, and sprayed into a drying tower with high temperature air supply at 250 degrees to make phenolic hollow microspheres X1.

[0033] After testing, the particle density of phenolic hollow microspheres X1 is 0.32g / cm 3 ; Breaking ball rate is 4.1%; Stacking coefficient is 5...

Embodiment 2

[0034] The preparation method of embodiment 2 phenolic hollow microspheres X2

[0035] Selecting the water-soluble thermosetting phenolic resin with a solid content of 55% and a viscosity of 3000 centipoise as one of the raw materials, according to the ratio of 120:0.5:5 by weight, the water-soluble thermosetting phenolic resin: foaming agent: surfactant Stir evenly, add water to obtain a precursor material of phenolic hollow microspheres with a viscosity of 500 centipoise. Wherein the foaming agent is selected as a mixture of foaming agent H and foaming agent AC (the ratio of the two is 1:1), and the surfactant is selected as BD-3088 (belonging to organosilane surfactants) and lauryl sulfuric acid Sodium mixture (1:1 ratio). Put the prepared phenolic hollow microsphere precursor material into a nebulizer to atomize into fine droplets, and spray it into a drying tower with a high-temperature air supply of 280 degrees to make phenolic hollow microspheres X2.

[0036] After te...

Embodiment 3

[0037] The preparation method of embodiment 3 phenolic hollow microspheres X3

[0038] Selecting the water-soluble thermosetting phenolic resin with a solid content of 70% and a viscosity of 5000 centipoise as one of the raw materials, the water-soluble thermosetting phenolic resin with water as the solvent in a ratio of 100:8:1 by weight: foaming Agent: Stir the surfactant evenly, add water to obtain the precursor material of phenolic hollow microspheres with a viscosity of 700. Wherein the foaming agent is selected as a mixture of foaming agent H and foaming agent ADC (the ratio of the two is 1:1), and the surfactant is selected as a mixture of BD-3088 (belonging to organosilane surfactants) and Tween 80 (The ratio of the two is 1:1). Put the prepared phenolic hollow microsphere precursor material into a sprayer to atomize into fine droplets, and spray it into a drying tower with a high temperature air supply of 230 degrees to make phenolic hollow microspheres X3.

[0039]...

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Abstract

The invention relates to a preparation method of high-performance phenolic hollow microspheres, comprising the steps: adding a foaming agent, a surfactant and water to a water-soluble thermosetting phenolic resin, and adopting a spray drying process to simultaneously realize the foaming and curing of a phenolic resin in a spray drying tower. The invention also provides the phenolic hollow microsphere obtained by the method, which has the advantages of good roundness, high stacking coefficient and low ball breaking rate, and can be applied to adhesives, coatings and composite materials and other fields as a lightweight functional filler.

Description

technical field [0001] The invention relates to a preparation method of high-performance phenolic hollow microspheres. Background technique [0002] Phenolic resin hollow microspheres are a new chemical material with a special hollow structure whose core is air or other gases and the outer layer is phenolic resin. Phenolic hollow microspheres have the characteristics of small particle size, low density, high specific surface area, low thermal conductivity, excellent thermal stability, low temperature and thermal conductivity, and can absorb electromagnetic waves. Adding hollow microspheres as fillers to composite materials and coatings can effectively reduce the density of materials and achieve heat resistance / insulation performance. [0003] The preparation methods of the phenolic hollow microspheres include a layer-by-layer self-assembly method, a template removal method, an interface reaction method, and an emulsion method. Among them, the layer-by-layer self-assembly m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/06C08J9/10C08J9/30
CPCC08J9/103C08J9/107C08J9/30C08J2203/04C08J2203/18C08J2361/06
Inventor 赵彤李昊姜言彬
Owner INST OF CHEM CHINESE ACAD OF SCI
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