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A kind of solvent-free self-healing epoxy resin and preparation method thereof

An epoxy resin, self-healing technology, applied in the direction of epoxy resin coatings, coatings, etc., can solve the problems of energy consumption and environmental problems of volatile matter release, single self-healing mechanism, and inability to obtain epoxy resin materials, etc. Good green environmental protection characteristics, simple process effect

Active Publication Date: 2021-01-15
南宁本吉生物科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on the one hand, the introduction of structural units with dynamic reversible covalent bonds or reversible non-covalent bonds into the epoxy resin chain generally requires the addition of co-solvents in the reaction system, which will lead to self-healing epoxy During the preparation and use of resin materials, volatile matter (VOC) release, energy consumption and environmental problems are caused; on the other hand, the self-healing mechanism of existing self-healing epoxy resin materials is relatively simple, and it is impossible to obtain comprehensive performance Epoxy material with good and ideal self-healing effect

Method used

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  • A kind of solvent-free self-healing epoxy resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Pre-stir and mix 100g of epoxy resin (diphenol-propane glycidyl ether), 10g of neopentyl glycol diglycidyl ether, and 20g of lipoic acid at room temperature; heat to 90°C, stir for 150 minutes, and then add 1g of chlorinated Iron, reacted for 4h; then, followed by vacuum defoaming to obtain a solvent-free self-healing epoxy resin.

[0026] See attached figure 1 , which is a self-healing photo of the solvent-free self-healing epoxy resin coating provided in this example. First, use a scalpel to create cracks in the solvent-free self-healing epoxy coating provided in this example, and then place the film on a hot stage; the solvent-free self-healing ring The epoxy resin coating is heated to 80°C and maintained at a constant temperature until the cracks disappear. The results showed that the cracks did not change significantly below 70°C, but when the temperature was close to 80°C, the cracks began to change significantly, and when the temperature was maintained at 80°C ...

Embodiment 2

[0028] Pre-stir and mix 100g epoxy resin (bisphenol A type epoxy resin), 100g dipropylene glycol diglycidyl ether, and 60g lipoic acid at room temperature; heat to 80°C, stir for 100min, then add 0.1g ferric chloride , reacted for 1 h; then, followed by vacuum defoaming to obtain a solvent-free self-healing epoxy resin.

[0029] Referring to the self-healing observation method in Example 1, the solvent-free self-healing epoxy resin coating provided in this example can realize the self-healing function at 50°C.

Embodiment 3

[0031] Pre-stir and mix 100g epoxy resin (bisphenol F type epoxy resin) and 20g lipoic acid at room temperature; heat to 120°C, stir and react for 5min, then add 0.5g calcium chloride, react for 2h; then, vacuum Degassing to obtain a solvent-free self-healing epoxy resin.

[0032] Referring to the self-healing observation method in Example 1, the solvent-free self-healing epoxy resin coating provided in this example can realize the self-healing function at 60°C.

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Abstract

The invention discloses solvent-free self-repairing epoxy resin and a preparation method thereof. The solvent-free self-repairing epoxy resin provided by the invention is mainly prepared from the following raw materials: epoxy resin, an active diluting agent, lipoic acid, a metal compound and the like. According to the solvent-free self-repairing epoxy resin, the lipoic acid and the epoxy resin are combined to prepare the solvent-free self-repairing epoxy resin with a self-repairing function in one step; a technological process is simple and is suitable for industrialized production; a structure unit with a reversible property of a dynamic reversible covalent bond (disulfide bond) or a reversible non-covalent bond mutual effect (a hydrogen bond and a coordinate bond) is introduced into anepoxy resin chain, and an epoxy resin material with a plurality of self-repairing complex mechanisms is provided; a solvent does not need to be used in preparation and application processes of the self-repairing epoxy resin material, and the self-repairing epoxy resin material has good green and environment-friendly properties.

Description

technical field [0001] The invention belongs to the field of epoxy resin and its preparation, in particular to a solvent-free self-repairing epoxy resin and its preparation method. Background technique [0002] Epoxy resin is one of the most widely used thermosetting resins. It has the characteristics of strong adhesion, small shrinkage, good corrosion resistance, excellent electrical properties, good durability, easy modification and easy access to raw materials. With the rapid development of national construction and the continuous birth of new fields, higher requirements are put forward for the functional development of epoxy resin. In many studies on epoxy resin modification, it can be found that the functionalization of epoxy resin is mainly carried out in the directions of high temperature resistance, metal corrosion resistance, flame retardant, fire resistance, wear resistance, insulation, etc., and its ultimate purpose is to meet the requirements of aviation, aerospa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08G59/00C08G59/42
CPCC09D163/00C09D7/63C08K5/45
Inventor 刘云鸿彭新艳刘云晖
Owner 南宁本吉生物科技有限公司