Block copolymer used for specific nanostructure construction in epoxy resin and application of block copolymer in preparation of high toughness composite material

Abstract

The invention provides a block copolymer used for specific nanostructure construction in epoxy resin and an application of the block copolymer in preparation of a high toughness composite material. The experimental results show that the toughness of the PDMS-PCL / EP composite prepared by the present invention is significantly enhanced compared with the pure epoxy resin: when the PDMS1-PCL4 contentis 40 wt%, fracture toughness of a thermosetting material with a 10-60 nm worm-like nanostructure is increased by about 255% higher than that of the pure epoxy resin, and for spherical nanostructures,the fracture toughness is only increased by 42% than that of pure epoxy resin at the same addition amount. Compared with the PCL-b-PDMS-b-PCL / EP composites, under the same addition amount, the toughness of the PDMS-PCL / EP composite prepared by the invention is obviously superior to that of the PCL-b-PDMS-b-PCL / EP composite, and the increase rate is 97%. The toughness of the PDMS-PCL / EP compositeprepared at a certain ratio has significant advantages, the PDMS-PCL / EP composite achieves unexpected technical effects, and can be used as a base material of a coating, an electrical material, a pouring sealed material, an adhesive, and a sealant, is widely used in aerospace, automobile, shipbuilding, construction, railway transportation and other fields.

Description

technical field [0001] The invention belongs to the field of polymer composite materials, and specifically relates to the application of block copolymers in the construction of specific nanostructures in epoxy resins and the preparation of high-toughness composite materials. Background technique [0002] Epoxy resin (EP) is an excellent high-strength thermosetting resin and is a widely used matrix material. EP molecules have two or more epoxy groups, which can be cross-linked and cured with amines, acid anhydrides, and polyamides to form a highly cross-linked three-dimensional network structure, and the cured product has wear resistance Good, excellent heat resistance, good chemical stability, excellent electrical insulation, high strength, low shrinkage, easy processing and molding, chemical resistance, good adhesion to substrates and low price, etc., as an electronic coating , coatings, electrical materials, casting packaging materials, adhesives, and sealant matrix resin...

AI Technical Summary

Problems solved by technology

However, the cured product formed after EP curing has a high crosslinking density, a three-dimensional network structure in space, difficult sliding between molecular chains, and large internal stress, resulting in hard and brittle cured products, easy cracking, poor impact resistance and peeling resistance. It is difficult to meet the use requirements in the application, so that its application is limited to a certain extent. These shortcomings are caused by the insufficient toughness of EP cured products.

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