OTFT ammonia gas sensor embedded with small molecule additive and preparation method of OTFT ammonia gas sensor
A technology of ammonia sensor and additive, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as poor stability, achieve good stability, improve stability, and be easy to implement and promote.
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Example Embodiment
[0057] Embodiment 1: A preferred embodiment of the present invention provides an OTFT ammonia sensor embedded with small molecule additives, such as figure 1 As shown, it is a bottom-gate top-contact structure. The materials and thicknesses of each layer of the device are: substrate 1 is glass; gate electrode 2 is ITO with a thickness of 200 nm; dielectric layer 3 is PMMA with a thickness of 500 nm; organic semiconductor layer 4 is P3HT with a thickness of 30 nm; the embedded small molecule additive 5 is TCNQ; the source electrode 6 and the drain electrode 7 are both Au and the thickness is 50 nm.
[0058] The preparation method is as follows:
[0059] 1. Thoroughly clean the substrate 1 on which the gate electrode ITO is sputtered, and dry it with dry nitrogen after cleaning;
[0060] 2. Using spin coating method to prepare PMMA film on the ITO surface to form a dielectric layer 3;
[0061] 3. Heat and bake the spin-coated PMMA film to remove excess solvent;
[0062] 4. Using spin coa...
Example Embodiment
[0065] Embodiment 2: A preferred embodiment of the present invention provides an OTFT ammonia sensor embedded with small molecule additives, such as figure 1 The bottom-gate top-contact structure is shown. The materials and thickness of each layer of the device are: substrate 1 is polytetrafluoroethylene; gate electrode 2 is ITO with a thickness of 200 nm; dielectric layer 3 is (PVP-co-PMF) , The thickness is 450nm; the organic semiconductor layer 4 is Tips-pentacene, the thickness is 35nm; the embedded small molecule additive 5 is F4TCNQ; the source electrode 6 and the drain electrode 7 are both Au and the thickness is 75nm.
[0066] The preparation method is the same as in Example 1.
Example Embodiment
[0067] Example 3: Such as figure 1 The bottom-gate top-contact structure is shown. The materials and thickness of each layer of the device are: substrate 1 is polyethylene terephthalate; gate electrode 2 is IZO with a thickness of 300 nm; dielectric layer 3 is (PVP -co-PMF) with a thickness of 1000 nm; the organic semiconductor layer 4 is P3HT with a thickness of 35 nm; the embedded small molecule additive 5 is TCAQ; the source electrode 6 and the drain electrode 7 are both Au and the thickness is 100 nm.
[0068] The preparation method is as follows:
[0069] 1. Thoroughly clean the substrate 1 on which the gate electrode IZO is sputtered, and dry it with dry nitrogen after cleaning;
[0070] 2. The PVP-co-PMF film is prepared on the surface of IZO by spin coating to form the dielectric layer 3;
[0071] 3. Heat and bake the spin-coated PVP-co-PMF film to remove excess solvent;
[0072] 4. Using spin coating method to prepare P3HT film on PVP-co-PMF to form organic semiconductor layer...
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