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A sn-cu-ni lead-free solder containing ga and nd

A sn-cu-ni, lead-free solder technology, used in welding/cutting media/materials, metal processing equipment, welding equipment, etc., can solve problems such as reducing the reliability of solder joints and short-circuiting electronic components

Active Publication Date: 2020-11-27
CHANGSHU HUAYIN FILLER METALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of use, it is found that with the prolongation of time, the thickness of the intermetallic compound at the brazing interface of the Sn-Cu-Ni solder with rare earth elements has a tendency to gradually increase and thicken, especially as the brazing joint increases. Over time, it is easy to sprout tin whiskers that can cause short circuits in electronic components, which will greatly reduce the "reliability" of soldered joints

Method used

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  • A sn-cu-ni lead-free solder containing ga and nd
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  • A sn-cu-ni lead-free solder containing ga and nd

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A Sn-Cu-Ni lead-free solder containing Ga and Nd, proportioned by mass percentage, its composition is: 0.5% Cu, 0.35% Ni, 0.003% Se, 0.003% Zr, 0.4% Ga, 0.04% Nd, balance Sn. The mass ratio of Ga and Nd added satisfies Ga:Nd=10:1.

[0028] The solidus temperature of "a Sn-Cu-Ni lead-free solder containing Ga and Nd" obtained from the above composition ratio is about 210°C, and the liquidus temperature is about 218°C (both taking into account experimental errors). Cooperating with commercially available RMA flux has excellent wetting performance on copper plate, and the tensile strength of brazing seam reaches 45MPa±5MPa.

[0029] image 3 It shows that after aging for 720 hours (30 days), the Sn-Cu-Ni lead-free solder brazing seam intermetallic compound added with Ga and Nd has no obvious change and no tin whisker sprouts, indicating the reliability of solder joints (brazing seams) has been significantly improved.

Embodiment 2

[0031] A Sn-Cu-Ni lead-free solder containing Ga and Nd, proportioned by mass percentage, its composition is 1.0% Cu, 0.05% Ni, 0.008% Se, 0.003% Zr, 0.6% Ga , 0.06% Nd, the balance is Sn. The mass ratio of Ga and Nd added satisfies Ga:Nd=10:1.

[0032] The solidus temperature of "a Sn-Cu-Ni lead-free solder containing Ga and Nd" obtained from the above composition ratio is about 210°C, and the liquidus temperature is about 218°C (both taking into account experimental errors). Cooperate with commercially available RMA flux to have excellent wettability on copper plate, and the tensile strength of brazing seam can reach 45MPa±5MPa.

[0033] image 3 It shows that after aging for 720 hours (30 days), there is no obvious change in the intermetallic compound at the interface of the Sn-Cu-Ni lead-free solder brazing seam containing Ga and Nd, and there is no tin whisker initiation, indicating that the solder joint (brazing seam) is reliable. performance has been significantly im...

Embodiment 3

[0035] A Sn-Cu-Ni lead-free solder containing Ga and Nd, proportioned by mass percentage, its composition is 0.7% Cu, 0.15% Ni, 0.005% Se, 0.002% Zr, 0.5% Ga , 0.05% Nd, the balance is Sn. The mass ratio of Ga and Nd added satisfies Ga:Nd=10:1.

[0036] The solidus temperature of "a Sn-Cu-Ni lead-free solder containing Ga and Nd" obtained from the above composition ratio is about 210°C, and the liquidus temperature is about 218°C (both taking into account experimental errors). Cooperating with commercially available RMA flux has excellent wetting performance on copper plate, and the tensile strength of brazing seam reaches 45MPa±5MPa.

[0037] image 3 It shows that after aging for 720 hours (30 days), there is no obvious change in the intermetallic compound at the interface of the Sn-Cu-Ni lead-free solder brazing seam containing Ga and Nd, and there is no tin whisker initiation, indicating that the solder joint (brazing seam) is reliable. performance has been significantl...

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Abstract

The invention discloses an Sn-Cu-Ni lead-free solder containing Ga and Nd and belongs to the soldering materials in the field of metallic materials and metallurgy. The Sn-Cu-Ni lead-free solder containing Ga and Nd comprises the following chemical components in percentage by mass: 0.5-1.0% of Cu, 0.05-0.35% of Ni, 0.003-0.008% of Se, 0.001-0.003% of Zr, 0.4-0.6% of Ga, 0.04-0.06% of Nd, and the balance Sn, specifically, the addition mass ratio of Ga to Nd is 10:1. The Sn-Cu-Ni lead-free solder has excellent wettability, can effectively restrain growth of thickness of intermetallic compounds ata soldering seam interface as well as growth of tin whiskers of a soldered joint, remarkably improves the reliability of the soldered joint and is suitable for wave-soldering of the electronic industry and other welding modes like reflow soldering.

Description

technical field [0001] The invention relates to a Sn-Cu-Ni lead-free solder containing Ga and Nd, belonging to metal materials and brazing materials in the field of metallurgy. It is mainly used for the assembly and packaging of components in the electronic industry. It is a new type of green product with good brazing performance (such as wetting performance), excellent mechanical properties of solder joints (brazing seams), and can effectively inhibit the growth of tin whiskers in brazing joints. , Environmentally friendly lead-free solder. Background technique [0002] The traditional Sn-Pb solder is widely used in the field of electronic assembly and packaging due to its good wettability, low cost, and low melting point, but the Pb element is harmful to the environment and the human body. The Sn-based lead-free solders studied today mainly include Sn-Ag, Sn-Ag-Cu, Sn-Zn, Sn-Cu, Sn-Bi, etc. Sn-Cu alloy solder is widely used because of its low cost and good thermal fatigu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 顾立勇顾文华顾建昌
Owner CHANGSHU HUAYIN FILLER METALS
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