Sn-Ag-Cu lead-free solder containing Ga and Nd

A lead-free solder, mass percentage technology, applied in the direction of welding/cutting media/materials, metal processing equipment, welding equipment, etc., can solve problems such as the influence of soldering joints on electronic products, achieve improved run-and-display performance, and increase shear resistance Strength and reliability improvement effect

Active Publication Date: 2018-12-21
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the "Sn-Ag-Cu lead-free solder containing Nd and Ga" reduces the Ag content to the range of 0.01-0.5%, the content of the rare element Ga is still high at 0.003-1.5%, and when the rare earth element Nd When the upper limit of 0.001 to 0.5% is reached to 0.5%, the brazing joint is likely to produce a hidden danger that has a huge impact on electronic products - tin whiskers

Method used

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  • Sn-Ag-Cu lead-free solder containing Ga and Nd
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  • Sn-Ag-Cu lead-free solder containing Ga and Nd

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Sn-Ag-Cu lead-free solder containing Ga and Nd, including: 0.1% Ag, 1.0% Cu, 0.125% Ga, 0.025% Nd, 0.006% Zr, 0.003% Te by mass percentage , the balance being Sn.

[0030] The liquidus temperature of the "Sn-Ag-Cu lead-free solder containing Ga and Nd" obtained by the above composition ratio is about 218°C (considering the experimental error), and the commercially available water-soluble flux (FLUX 3355-11 water-soluble Organic acid flux) has excellent wetting performance on T2 copper plate, and the mechanical properties of brazing seam can reach 85MPa±5MPa (shear strength). After aging for 6 months at 150°C, the intermetallic compound at the interface of the newly invented lead-free solder has no obvious change and no tin whiskers have sprouted, indicating that the reliability of the solder joint (solder joint) has been significantly improved.

Embodiment 2

[0032] Sn-Ag-Cu lead-free solder containing Ga and Nd, including: 0.35% Ag, 0.1% Cu, 0.5% Ga, 0.1% Nd, 0.002% Zr, 0.001% Te by mass percentage , the balance being Sn.

[0033] The liquidus temperature of "a kind of Sn-Ag-Cu lead-free solder containing Ga and Nd" obtained by the above composition ratio is about 218°C (experimental error is considered), and the commercially available water-soluble flux (FLUX 3355- 11 Water-soluble organic acid flux) has excellent wetting performance on T2 copper plate, and the mechanical properties of brazing seam can reach 85MPa±5MPa (shear strength). After aging for 6 months at 150°C, the intermetallic compound at the interface of the newly invented lead-free solder has no obvious change and no tin whiskers have sprouted, indicating that the reliability of the solder joint (solder joint) has been significantly improved.

Embodiment 3

[0035] Sn-Ag-Cu lead-free solder containing Ga and Nd, including: 0.3% Ag, 0.7% Cu, 0.4% Ga, 0.08% Nd, 0.004% Zr, 0.002% Te by mass percentage , the balance being Sn.

[0036] The liquidus temperature of the "Sn-Ag-Cu lead-free solder containing Ga and Nd" obtained by the above composition ratio is about 218°C (considering the experimental error), and the commercially available water-soluble flux (FLUX 3355-11 water-soluble Organic acid flux) has excellent wetting performance on T2 copper plate, and the mechanical properties of brazing seam can reach 85MPa±5MPa (shear strength). After aging for 6 months at 150°C, the intermetallic compound at the interface of the newly invented lead-free solder has no obvious change and no tin whiskers have sprouted, indicating that the reliability of the solder joint (solder joint) has been significantly improved.

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Abstract

The invention discloses a Sn-Ag-Cu lead-free solder containing Ga and Nd, and belongs to metal materials and soldering materials in the field of metallurgy. The Sn-Ag-Cu lead-free solder comprises, bymass, 0.1-0.35 % of Ag, 0.1-1.0 % of Cu, 0.125-0.5% of Ga, 0.025-0.1% of Nd, 0.002-0.006% of Zr, 0.001-0.003% of Te, and the balance Sn, wherein the mass ratio of Ga to Nd is 5:1, and the mass ratioof Zr to Te is 2:1. The solder has good wetting performance, growth of tin whiskers of a soldering joint can be effectively inhibited, the reliability of the soldering joint is greatly improved, and the Sn-Ag-Cu lead-free solder can be used for reflow soldering of components in the electronic industry and can also be used for wave soldering.

Description

technical field [0001] The invention relates to a Sn-Ag-Cu lead-free solder containing Ga and Nd, belonging to metal materials and brazing materials in the field of metallurgy. Background technique [0002] At present, representative lead-free solders include Sn-Ag-Cu, Sn-Cu, Sn-Cu-Ni and other alloy systems, each with its own strengths, but compared with tin-lead solders, the cost of solder and solder There is still a certain gap in terms of melting point and so on. Sn-Zn solder melting point and raw material cost are lower than Sn-Ag-Cu, Sn-Cu, Sn-Cu-Ni solder, especially Sn-Zn solder melting point is very close to tin-lead solder, but due to Sn The wettability of -Zn solder is poor, so it is difficult to be applied to industrial production at present. [0003] In recent years, "Sn-Ag-Cu lead-free solder containing Pr, Zr, Co" (Chinese patent application, CN101579789A), "Containing Nd, Li, As, In" have been developed on the basis of Sn-Ag-Cu at home and abroad. "Sn-Ag-C...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 薛鹏梁伟良王克鸿裴夤崟孙华为
Owner NANJING UNIV OF SCI & TECH
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