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Display substrate and preparation method thereof

A technology for displaying substrates and carrying substrates, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as insufficient bonding strength between inorganic and organic films, separation of organic and inorganic films, etc. , to achieve the effect of enhancing device reliability, improving bonding strength, and improving yield

Active Publication Date: 2019-02-05
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a method for preparing a display substrate to solve the technical problem that in the existing display substrate, the bonding strength between the inorganic film layer and the organic film layer is not enough, which leads to the separation of the organic film layer from the inorganic film layer during the peeling process

Method used

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  • Display substrate and preparation method thereof
  • Display substrate and preparation method thereof
  • Display substrate and preparation method thereof

Examples

Experimental program
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Embodiment 1

[0050] A method for preparing a display substrate, such as figure 1 Shown, described preparation method comprises:

[0051] S10, providing a bearing base;

[0052] S20, sequentially forming a first organic layer, an inorganic barrier layer and a second organic layer by laminating on the carrier substrate;

[0053] Wherein, the S20 includes:

[0054] Step S21, forming a first organic layer on the carrier substrate;

[0055] Step S22, forming a first silane coupling layer on the first organic layer;

[0056] Step S23, forming an inorganic barrier layer on the first silane coupling layer;

[0057] Step S24, forming a second silane coupling layer on the inorganic barrier layer;

[0058] Step S25, forming a second organic layer on the second silane coupling layer.

[0059] Wherein, both the first silane coupling layer and the second silane coupling layer are made of a silane coupling agent by spraying or coating. The silane coupling agent is a material containing both inorgan...

Embodiment 2

[0090] Such as Figure 4 As shown, the second groove 41 includes a plurality of grooves, and both ends of the grooves extend toward the edge of the inorganic barrier layer 40 to penetrate the inorganic barrier layer 40 . The main advantage of inorganic materials is better water and oxygen barrier performance, but compared with organic materials, inorganic materials have poor bending resistance. When the display panel is bent, the thicker inorganic film may crack or break. The second groove 41 is used as a bending stress release area when the display substrate is bent, and the inorganic film layer at the bottom of the second groove 41 is thinner, so that it can bear greater bending stress, thereby preventing inorganic barriers during the bending process of the display substrate. Layer 40 is cracked or broken.

[0091] as shown in the picture Figure 5 As shown, the vertical projection of the groove does not coincide with the vertical projection of the filling block 42 . The ...

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Abstract

The invention provides a preparation method of a display substrate. The preparation method includes providing a bearing substrate; forming a first organic layer on the bearing substrate; forming a first silane coupling layer on the first organic layer; forming an inorganic barrier layer on the first silane coupling layer; forming a second silane coupling layer on the inorganic barrier layer; and forming a second organic layer on the second silane coupling layer. The bonding intensity of the inorganic barrier layer and the organic layers can be greatly enhanced by utilizing the silane couplinglayers prepared by a silane coupling agent as a binder between the inorganic barrier layer and the organic layers to form chemical bond connection, and therefore, the separating problem of the inorganic barrier layer and the organic layers can be effectively avoided, the yield rate of products can be greatly increased, and the reliability of devices can be enhanced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing a display substrate and the display substrate. Background technique [0002] With the continuous development of science and technology, the field of display technology has also been continuously updated. The future demand for displays is also gradually becoming more convenient and more friendly to the applicable environment. Therefore, making lighter, thinner, and more convenient products, while consuming lower power consumption and improving picture quality is a problem that researchers and the industry need to solve. Flexible devices made of flexible substrates are expected to become mainstream devices for next-generation optoelectronic devices. [0003] Compared with traditional flat-panel liquid crystal displays, flexible display devices, such as Organic Light-Emitting Diode (OLED), use bendable flexible substrates to replace thick and hard glass. I...

Claims

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Application Information

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IPC IPC(8): H01L51/56H01L51/52
CPCH10K50/8445H10K71/00
Inventor 郑颖
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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