Display substrate and preparation method thereof
A technology for displaying substrates and carrying substrates, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as insufficient bonding strength between inorganic and organic films, separation of organic and inorganic films, etc. , to achieve the effect of enhancing device reliability, improving bonding strength, and improving yield
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[0049] Example one:
[0050] A method for preparing a display substrate, such as figure 1 As shown, the preparation method includes:
[0051] S10. Provide a supporting substrate;
[0052] S20: Laminating and forming a first organic layer, an inorganic barrier layer, and a second organic layer in sequence on the carrier substrate;
[0053] Wherein, the S20 includes:
[0054] Step S21, forming a first organic layer on the supporting substrate;
[0055] Step S22, forming a first silane coupling layer on the first organic layer;
[0056] Step S23, forming an inorganic barrier layer on the first silane coupling layer;
[0057] Step S24, forming a second silane coupling layer on the inorganic barrier layer;
[0058] Step S25, forming a second organic layer on the second silane coupling layer.
[0059] Wherein, the first silane coupling layer and the second silane coupling layer are both made of a silane coupling agent by spraying or coating. The silane coupling agent is a material containing both ...
Example Embodiment
[0089] Embodiment two:
[0090] Such as Figure 4 As shown, the second groove 41 includes a plurality of grooves, and both ends of the grooves extend toward the edge of the inorganic barrier layer 40 to penetrate the inorganic barrier layer 40. The main advantage of inorganic materials is that they have better water and oxygen barrier properties, but compared to organic materials, inorganic materials have poor bending resistance. When the display panel is bent, the thicker inorganic film may crack or break. The second groove 41 is used as a bending stress relief area when the display substrate is bent, and the inorganic film layer at the bottom of the second groove 41 is thin, which can bear greater bending stress, thereby preventing inorganic barriers during the bending process of the display substrate The layer 40 is cracked or broken.
[0091] As shown Figure 5 As shown, the vertical projection of the groove and the vertical projection of the filling block 42 do not coincide....
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