Anti-PID heat conduction glue film, photovoltaic assembly and photovoltaic power generation system

A thermally conductive adhesive film and photovoltaic module technology, applied in photovoltaic power generation, semiconductor devices, circuits, etc., can solve problems such as poor anti-PID performance, material aging, and low output power

Active Publication Date: 2019-02-12
CECEP SOLAR ENERGY TECH (ZHENJIANG) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an anti-PID heat-conducting adhesive film, a photovoltaic module and a photovoltaic power generation system, which s

Method used

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  • Anti-PID heat conduction glue film, photovoltaic assembly and photovoltaic power generation system
  • Anti-PID heat conduction glue film, photovoltaic assembly and photovoltaic power generation system
  • Anti-PID heat conduction glue film, photovoltaic assembly and photovoltaic power generation system

Examples

Experimental program
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Effect test

Embodiment 1

[0062] A photovoltaic module, which includes an upper cover plate 1, a first adhesive film 2, the battery 3, the anti-PID thermally conductive adhesive film and the back plate 5, which are sequentially stacked. The first adhesive film 2 is bonded between the upper cover plate 1 and the battery 3 , and the anti-PID thermally conductive adhesive film is bonded between the battery 3 and the back plate 5 .

[0063] Wherein, the upper cover plate 1 is a heat-strengthened glass cover plate, the first adhesive film 2 is an EVA film, the battery 3 is a battery string, and the back plate 5 is TPT.

[0064] The material of the film body of the anti-PID thermally conductive adhesive film is EVA, the shell material of the core-shell particles is polyethylene, and the core material of the core-shell particles is aluminum oxide. The mass percentage of the core-shell particles in the anti-PID heat-conducting adhesive film is 15%, the particle diameter of the core-shell particles is 2 μm, and...

Embodiment 2

[0066] A photovoltaic module, which is different from Embodiment 1 in that: the first adhesive film 2 is a POE film, the material of the adhesive film body of the anti-PID heat-conducting adhesive film is POE, and the back plate 5 is heat-strengthened glass.

Embodiment 3

[0068] A photovoltaic module, which is different from Embodiment 1 in that: the first adhesive film 2 is a PVB film, the material of the film body of the anti-PID heat-conducting adhesive film is PVB, and the back plate 5 is heat-strengthened glass.

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Abstract

The invention relates to an anti-PID heat conduction glue film, a photovoltaic assembly and a photovoltaic power generation system, and belongs to the technical field of photovoltaics. The anti-PID heat conduction glue film comprises a glue film body and core-shell particles doped in the glue film body; each core-shell particle comprises an insulation inorganic heat conduction material inner coreand a protection outer shell coated at the outer surface of the insulation inorganic heat conduction material inner core. The photovoltaic assembly comprises the anti-PID heat conduction glue film; the anti-PID heat conduction glue film is bonded between a backboard of the photovoltaic assembly and a battery of the photovoltaic assembly. The photovoltaic power generation system comprises a plurality of photovoltaic assemblies in series connection and/or parallel connection arrangement. Insulation and heat conduction core-shell particles are doped in the glue film body and can be stably dispersed in the glue film for a long time. When the photovoltaic assembly is locally shielded or works at high irradiation, the core-shell particles can realize fast heat absorption or heat radiation; the battery temperature is reduced; the assembly output power is improved. Meanwhile, the core-shell particles have good insulation performance; the current passage channel can be isolated; the volume resistivity of the glue film is improved; the anti-PID performance of the assembly is greatly improved.

Description

technical field [0001] The invention relates to the field of photovoltaic technology, in particular to an anti-PID heat-conducting adhesive film, a photovoltaic module and a photovoltaic power generation system. Background technique [0002] In order to curb pollution and develop green energy, photovoltaic technology has developed rapidly in recent years. However, the high cost of electricity is still the main factor restricting photovoltaics from occupying the mainstream energy market. [0003] At present, the commonly used efficiency improvement methods include stacking technologies such as PERC, PERT, double-sided, multi-busbar, large-size silicon wafers, reflective ribbons, and white EVA, which lead to a substantial increase in the power of a single module. However, the higher the power of conventional series modules, on the one hand, the temperature of the modules will continue to increase during operation, and the power of the modules has an inverse linear relationshi...

Claims

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Application Information

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IPC IPC(8): C09J7/10C09J11/04H01L31/048H01L31/052
CPCC08K9/10C08K2003/2227C09J7/00C09J11/04H01L31/0481H01L31/052Y02E10/50
Inventor 姜亚帅周肃史振侠陈鹏王晨阳黄青松黄国平李菁楠
Owner CECEP SOLAR ENERGY TECH (ZHENJIANG) CO LTD
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