A Method for Measuring Post-soldering Alignment Deviation at Key Positions of Optical Interconnection Modules

Abstract

The invention discloses a method for measuring the alignment deviation of the key position of an optical interconnection module after welding, which is to clamp the bottom of the optical interconnection module and put it into a temperature control box, and apply a temperature load to the optical interconnection module for welding , connect the Michelson interferometer in the cooling and solidification stage, and the two He-Ne laser beams separated by the beam splitter are reflected back to the observation screen by the fixed mirror and the moving mirror respectively, thereby causing interference phenomenon. When the measurement position of the experimental sample is displaced, It will drive the moving mirror to move together, causing the optical path difference of the two reflected laser beams to change continuously, and N rings will disappear or emerge in the center of the interference ripple, and then the X and Y directions at the key positions of the optical interconnection module can be calculated according to the formula displacement value. This method can calculate the post-soldering offset value of the key position of the optical interconnection module, and how to reduce the initial alignment offset after welding is a key issue for improving the long-term work of the optical interconnection module and improving the coupling efficiency of the optical interconnection module Provide experimental data.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging optical interconnection, in particular to a method for measuring the post-welding alignment deviation of key positions of an optical interconnection module by using a Michelson interferometer. Background technique [0002] "Optical Interconnect" (Optical Interconnect, OI) refers to the use of photons as the information carrier. The optical signal emitted by the optical signal source passes through the optical coupling element, optical transmission medium and other devices to the signal receiving end, and then the optical signal is converted by the converter. For the required information, the signal transmission-transmission-reception process is realized. Optical interconnection technology originated from the development and research of photonic computers. Optical scientist J.M.Goodman first proposed to apply optical interconnection technology to large-scale integrated circuits, t...

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Problems solved by technology

[0007] In the above three documents, the optical transmission alignment deviation and coupling efficiency of the optical interconnection module after mechanical installation and thermal cycle working environment were studied, but the alignment deviation of the optical interconnection module after soldering and packaging was not studied. analyze

During the welding and packaging process of the optical interconnection module, the thermal expansion coefficient mismatch between the substrate and the PCB will lead to alignment shifts at key positions, although the resulting alignment shifts are generally on the order of microns, but the resulting Optical power loss may even be as high as 50% or more

Since the optical interconnection device needs to be soldered and installed before use, the resulting optical path alignment error is a systematic error, which will always exist in the later use of the device and continue to affect the normal operation of the optical interconnection system

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