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Efficient and energy-saving cleaning process for epoxy coating in waste circuit boards

A waste circuit board, epoxy coating technology, applied in the removal of solid waste, cleaning methods using liquids, recycling of electronic waste, etc., can solve the problems of environmental hazards, high cost, high equipment requirements, and achieve high cleaning efficiency , The effect of reducing ultrasonic treatment time and short time

Inactive Publication Date: 2019-02-22
QINGYUAN JINTIAN ENTERPRISE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still problems such as low recovery rate of glass fiber and other metals, low reuse rate of molten salt, high equipment requirements, large investment, and high cost.
[0005] The supercritical fluid method is to use supercritical fluid to quickly oxidize the organic matter on the circuit board to decompose the cured resin, but this treatment technology also has a big defect: the decomposition products are extracted into the fluid phase, and then the copper foil and glass fiber are recovered , but the pressure and temperature required for extraction are relatively high, requiring high equipment and high energy consumption, and entraining agents need to be added during the extraction process, which is harmful to the environment
Therefore, the supercritical fluid method has not yet been applied to the actual processing device of the printed circuit board.

Method used

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  • Efficient and energy-saving cleaning process for epoxy coating in waste circuit boards
  • Efficient and energy-saving cleaning process for epoxy coating in waste circuit boards
  • Efficient and energy-saving cleaning process for epoxy coating in waste circuit boards

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Experimental program
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Embodiment 1

[0043] A high-efficiency and energy-saving cleaning process for epoxy coatings in waste circuit boards, comprising the following steps:

[0044] A. Broken

[0045] Put the waste circuit board into the crushing device for crushing, and crush it into blocks with a length of 1.2-1.8cm and a width of 0.8-1.2cm, and each block weighs between 2g-5g;

[0046] B. Soak

[0047] Soak the broken circuit board in a sodium hydroxide solution with a concentration of 5N for 8 hours;

[0048] C. Ultrasonic cleaning

[0049] Take out the soaked circuit board and put it into an ultrasonic cleaner. The model of the ultrasonic cleaner is Shumei brand KQ-250DE desktop numerical control ultrasonic cleaner. Add water at a temperature of 35°C into the ultrasonic cleaner, start the ultrasonic cleaner, and perform ultrasonic treatment for 5 minutes at an ultrasonic frequency of 60 Hz.

[0050] In step A, the crushing device used is as figure 1 As shown, the crushing box 1 is included. The crushing...

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Abstract

The invention belongs to the field of circuit board recycling, and particularly discloses an efficient and energy-saving cleaning process for epoxy coating in waste circuit boards. The cleaning process comprises three steps of crushing, soaking and ultrasonic cleaning. Through the efficient and energy-saving cleaning process for the epoxy coating in the waste circuit boards, the epoxy coating in the circuit boards can be cleaned efficiently and economically, and the cost is low.

Description

technical field [0001] The invention belongs to the field of circuit board recycling, and in particular relates to a high-efficiency and energy-saving cleaning process for epoxy coatings in waste circuit boards. Background technique [0002] Printed circuit boards are the core of all electronic equipment. With the upgrading of electronic equipment, more and more waste circuit boards are produced. Because waste circuit boards contain a large amount of non-ferrous metals and precious metals, they have high recycling value and are known as "urban mines". The substrate of the circuit board is mainly composed of resin, glass fiber and copper foil. There are a large number of electronic components fixed on the substrate. The pins of the electronic components are usually made of iron. After the electronic components are removed, the pins are easy to adhere to the substrate. The foils are bonded to the substrate by means of epoxy resin adhesives. In order to better realize metal co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B09B3/00B08B3/12B08B3/08
CPCB08B3/08B08B3/12B09B3/00Y02W30/82
Inventor 赖建明倪文
Owner QINGYUAN JINTIAN ENTERPRISE