Superconducting quantum bit chip

A superconducting quantum and bit technology, applied in quantum computers, computing models, calculations, etc., can solve the problems of complex chip manufacturing process, high chip circuit complexity, and qubit interconnection breakpoints, etc., to improve interconnection reliability, prevent The effect of qubits interconnecting breakpoints, increasing flexibility

Active Publication Date: 2019-02-22
TSINGHUA UNIV
View PDF8 Cites 28 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Attached Figure 1(a) is a one-dimensional qubit layout (such as Google, Rigetti Computing and other companies recently adopted), in which adjacent qubits are directly coupled to each other, and another dimension in the chip plane can be used to control qubit manipulation and state reading. The relevant circuit is taken. The quantum circuit of this layout is simple and intuitive, but the reliability of qubit interconnection is low. Once a qubit in the link fails, the pairwise coupling between qubits will be broken. Therefore, this Quantum chips are less fault-tolerant
Attached Figure 1(b) is a two-dimensional layout of qubits (the scheme planned by IBM, Intel and other companies), also known as surface code (surface code), its advantage is that the quantum chip has relatively high fault tolerance and can run quantum Error correction algorithm, but the chip circuit complexity of this qubit layout is very high, there is still the possibility of qubit interconnection breakpoints, and the control and reading circuits need to be wired in the third dimension to complete the interconnection, which requires a three-dimensional integrated circuit, thus The chip manufacturing process is extremely complicated, which affects the reliability of the chip
[0006] It is foreseeable that for quantum chips using the above two architectures, as the number of superconducting qubits increases, the demand for control line layout, signal cross-effects, and microwave equipment required to fully control the qubits will also show rapid growth. This will undoubtedly become a constraint for the realization of large-scale quantum computers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Superconducting quantum bit chip
  • Superconducting quantum bit chip
  • Superconducting quantum bit chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038]In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are forms known to those of ordinary skill in the art. Additionally, while illustrations of parameters containing particular values ​​may be provided herein, it should be understood that parameters need not be exactly equal to the corresponding values, but rather approximate the corresponding values ​​within acceptable error margins or design constraints. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present i...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a superconducting quantum bit chip, comprising a quasi-one-dimensional network chain structure layout superconducting quantum bit array and a manipulating and reading microwavecircuit, wherein each mesh unit comprises n qubits, and m (m and n are natural numbers, n>m>=2) shared qubits between adjacent networks are used for interconnection between mesh units; Each superconducting qubit in the mesh unit is coupled to the same coplanar superconducting microwave cavity for interconnection of qubits in the network. Each qubit is coupled to a coplanar superconducting microwave cavity and further coupled to a coplanar microwave transmission line, and is connected to an external circuit for qubit state reading. The present application can effectively prevent the possibility of qubit interconnection breakpoints, greatly improve interconnection reliability, increase the flexibility of error correction coding design, effectively reduce the complexity of qubit manipulationand reading circuits, and has an important scientific research and industrial application prospect.

Description

technical field [0001] The present invention relates to but not limited to the technical field of superconducting quantum computing, in particular to a superconducting qubit chip. Background technique [0002] A quantum computer is a device that uses quantum logic to perform general-purpose computing. Compared with traditional computers, quantum computers can greatly reduce the calculation time when solving important specific problems, so they have attracted wide attention. The core of a quantum computer is a quantum chip composed of a large number of interacting qubits. [0003] Quantum chips based on superconducting materials can use existing semiconductor process technology to achieve large-scale integration. Superconducting qubits show key indicators for quantum computing such as interaction control, selective operation, and error correction. It is one of the most promising platforms for realizing quantum computers because of its superior performance compared with othe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06N99/00
CPCG06N10/40G06N10/20
Inventor 段路明宋袆璞张宏毅
Owner TSINGHUA UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products