Optical module

A technology of optical modules and photoelectric components, applied in the field of optical modules, can solve problems affecting high-frequency signal impedance, high thermal expansion coefficient, airtight failure, etc., achieve good airtight performance, ensure transmission quality, and reduce expansion deformation

Active Publication Date: 2019-02-26
INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

And this will cause the wiring to be very long, which will affect the impedance of the high-frequency signal and eventually degrade the signal
In addition, the rigid circuit board 11 is relatively thick, so the coefficient of thermal expansion is relatively high, and the deformation caused by the thermal expansion of the entire thickness of the rigid circuit board 11 is relatively large, resulting in airtight failure

Method used

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no. 1 example

[0026] ginseng image 3 and Figure 4 , the first embodiment provided by the present invention discloses an optical module. In this embodiment, the optical module includes a housing 18, a sealing case 20 disposed in the housing 18, and a sealing case 20 disposed in the sealing case 20. Optoelectronic components 22.

[0027] The optoelectronic component 22 is packaged in a sealed case. Here, it should be noted that the optical modules mentioned in this application can be, for example: transmitter OSA (TOSA), at this time, the optoelectronic components 22 generally include semiconductor laser diodes (LD); receiver OSA (ROSA ), at this time, the optoelectronic component 22 generally includes a photodiode (PD); or has both sending and receiving functions, at this time, the optoelectronic component 22 generally includes a semiconductor laser diode and a photodiode at the same time. In the description of this embodiment and the accompanying drawings, the optoelectronic component ...

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Abstract

The invention discloses an optimal module comprising a casing, a sealing shell arranged in the casing, an optoelectronic component and a circuit board. The optoelectronic component is arranged in thesealing casing, and the circuit board is electrically connected to the optoelectronic component in the sealing casing, wherein the circuit board includes a first board and a second board disposed on the surface of the first board, the thickness of the second board is smaller than that of the first board, the second board includes a high-speed link layer disposed on a surface layer and a referencelayer disposed under the surface layer, the second board extends into the sealing casing and is electrically connected to the optoelectronic component, one side wall of sealing casing comprises a carrier and an insulating plate, the second board of the circuit board passes through an opening between the carrier and the insulating plate and is sealingly connected to the carrier and the insulating plate, and the insulating plate is disposed at one side of the high-speed link layer of the second board. The optical module has good high-speed transmission performance, low cost and good air tightness.

Description

technical field [0001] The invention belongs to the technical field of manufacturing optical communication components, and in particular relates to an optical module. Background technique [0002] In the optical module, some devices need to work in a fixed temperature range, and a cooler is often required to control the temperature of the device. When the refrigerator controls the temperature, it needs to transfer the heat of the external environment connected to the refrigerator to the internal device connected to the refrigerator (usually a photoelectric device such as a laser). Especially when the temperature of the internal components is lower than the ambient temperature, it is easy to generate condensation around the refrigerator. Therefore, it is necessary to package the refrigerator and internal devices in a ceramic case. [0003] Such as figure 1 It is a schematic structural diagram of a conventional optical module with a cooler 2 . The structural diagram of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/42
CPCG02B6/4251G02B6/428G02B6/4286G02B6/4296
Inventor 汪振中贾秀红涂文凯
Owner INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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