optical module

Abstract

The invention discloses an optical module, which includes a housing, a sealing shell arranged in the housing, an optoelectronic component and a circuit board, the optoelectronic component is disposed in the sealing housing, the circuit board and the photoelectric module in the sealing housing The components are electrically connected, wherein the circuit board includes a first board and a second board disposed on the surface of the first board, the thickness of the second board is smaller than the thickness of the first board, and the second board is arranged on the surface of the first board. The board includes a high-speed link layer arranged on the surface layer and a reference layer arranged below the surface layer, and the second board extends into the sealed casing to be electrically connected with the photoelectric component; one of the side walls of the sealed casing includes The carrier and the insulating board, the second board of the circuit board passes through the opening between the carrier and the insulating board and is sealed and connected with the carrier and the insulating board, and the insulating board is arranged on the high-speed chain of the second board road layer side. The optical module has good high-speed transmission performance, low cost and good airtightness.

Description

technical field [0001] The invention belongs to the technical field of optical communication element manufacturing, and in particular relates to an optical module. Background technique [0002] In an optical module, some devices need to work in a fixed temperature range, and a refrigerator is often required to control the temperature of the device. When the refrigerator controls the temperature, it needs to transfer the heat from the external environment connected to the refrigerator to the internal devices (usually optoelectronic devices such as lasers) connected to the refrigerator. In particular, when the temperature of the internal devices is lower than the ambient temperature, condensation is likely to occur around the refrigerator. Therefore, it is necessary to encapsulate the cooler and internal components in a ceramic case. [0003] like figure 1 It is a schematic structural diagram of a traditional optical module with a cooler 2 . The schematic structural diagra...

AI Technical Summary

Problems solved by technology

And this will cause the wiring to be very long, which will affect the impedance of the high-frequency signal and eventually degrade the signal

In addition, the rigid circuit board 11 is relatively thick, so the coefficient of thermal expansion is relatively high, and the deformation caused by the thermal expansion of the entire thickness of the rigid circuit board 11 is relatively large, resulting in airtight failure

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