Chip on glass package assembly
一种封装组件、玻璃芯片的技术,应用在电气元件、电固体器件、半导体器件等方向,能够解决成本昂贵、触控显示器成本增加、柔性电路板设计和布局复杂等问题,达到降低生产成本的效果
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[0054] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. In addition, wherever possible, the same reference numerals represent the same or similar parts in the drawings and the embodiments.
[0055] figure 1 It is a partial top view of a chip on glass (COG) package assembly according to an exemplary embodiment. figure 2 is a block diagram of a glass die bonding package assembly according to an exemplary embodiment. Please refer to figure 1 and figure 2 , in this embodiment, the glass die bonding package assembly 100 can be a touch display panel. The glass die bonding package assembly 100 includes a glass substrate 110 , a first type chip 120 , a second type chip 130 and a plurality of connecting wires 140 . The glass substrate 110 includes an active region 112 and a peripheral region 114 connected to the active region 112 . In this embodiment, the glass substrate 1...
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