Adhesive composition for encapsulation materials of organic electronic device and adhesive film comprising the same for encapsulation materials of organic electronic device

A bonding composition, organic electronics technology, applied in the direction of polymer adhesive additives, film/sheet without carrier, non-polymer adhesive additives, etc., to achieve excellent moisture resistance and heat resistance, improve life and The effect of durability

Active Publication Date: 2019-03-05
INNOX ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The present invention is proposed in order to solve the above-mentioned problems. The technical problem to be solved by the present invention is to provide a solution that prevents access to organic electronic devices by removing and blocking moisture, impurities and other adverse causes, and does not occur when removing moisture. In addition to the delamination phenomenon that can occur, it has the effect of excellent moisture resistance and heat resistance

Method used

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  • Adhesive composition for encapsulation materials of organic electronic device and adhesive film comprising the same for encapsulation materials of organic electronic device
  • Adhesive composition for encapsulation materials of organic electronic device and adhesive film comprising the same for encapsulation materials of organic electronic device
  • Adhesive composition for encapsulation materials of organic electronic device and adhesive film comprising the same for encapsulation materials of organic electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0194] Embodiment 1: Preparation of adhesive film for packaging materials of organic electronic devices

[0195] (1) Formation of the first adhesive layer

[0196] In order to form the first adhesive layer, a random copolymer (first adhesive resin) obtained by copolymerizing ethylene, propylene, and a diene compound and a compound represented by the following chemical formula 1 were mixed in a weight ratio of 1:2.33 ( After the second binder resin) to prepare the first mixed resin, with respect to the first mixed resin of 100 parts by weight, drop into the first tackifier (SU-90 of 80 parts by weight) and 50 parts by weight of The second tackifier (SU-100, Cologne Industries), 11 parts by weight of acrylic acid (M200, Miwon Specialty Chemical) with a weight average molecular weight of 226 as a curing agent, 3 parts by weight of ultraviolet light initiator agent (irgacure TPO, Ciba) and 24 parts by weight of silica with an average particle diameter of 0.5 μm and then stirred. ...

Embodiment 2～22 and comparative example 1～14

[0211]Manufactured in the same manner as in Example 1, but by changing the weight average molecular weight of the first binder resin and the second binder resin, the content of the curing agent, the content of the ultraviolet initiator, etc., the adhesive films shown in Tables 1 to 8 below were produced.

experiment example 1

[0213] The following physical properties were measured for the adhesive films prepared in the Examples and Comparative Examples, as shown in Tables 1 to 8 below.

[0214] 1. Moisture penetration evaluation of adhesive film

[0215] After cutting the test piece with a size of 95mm×95mm, after removing the protective film on the non-alkali glass of 100mm×100mm, align the test piece so that the test piece is located 2.5mm inward from the edge of the four sides of the non-alkali glass, and use heating Roll lamination to 65°C for attachment. After removing the remaining release film in the attached test piece, cover it with another 100mm×100mm non-alkali glass, and use a vacuum laminator to laminate at a temperature of 65°C for one minute to prepare a bonded sample without air bubbles. The length of moisture penetration was observed in units of 1000 hours in a reliability chamber set at 85° C. and a relative humidity of 85% for the bonded sample.

[0216] 2. Evaluation of volume ...

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Abstract

The present invention relates to an adhesive composition for encapsulation materials of an organic electronic device and an adhesive film comprising the same for encapsulation materials of an organicelectronic device. More particularly, the present invention relates to an adhesive composition for encapsulation materials of an organic electronic device and an adhesive film for encapsulation materials of an organic electronic device, removing and blocking unidentified substances, such as moisture and impurities from the organic electronic device, having an effect of not causing delamination which may occur when the moisture is removed, and having excellent moisture resistance and heat resistance.

Description

technical field [0001] The present invention relates to an adhesive composition for an organic electronic device encapsulation material and an adhesive film for an organic electronic device encapsulation material comprising the same, and more specifically relates to the following adhesive composition for an organic electronic device encapsulation material and an organic electronic device encapsulation comprising the same Adhesive film for materials, that is, by removing and blocking moisture, impurities and other harmful substances so as not to be close to organic electronic devices, and does not occur delamination phenomenon that may occur when moisture is removed, and has moisture resistance and heat resistance excellent effect. Background technique [0002] An organic light emitting diode (OLED: Organic Light Emitting Diode) is a light emitting diode in which a light emitting layer is formed of an organic compound, and utilizes an electroluminescence phenomenon in which l...

Claims

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Application Information

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IPC IPC(8): C09J123/16C09J11/04C09J11/08C09J7/10
CPCC09J7/10C09J11/04C09J11/08C09J123/0815C08L2203/206C08L2201/08C08K2003/222C08K2003/2227C08K2003/2203C08K2003/2206C08L57/02C08L93/04C08L45/00C08K3/22C08K3/36C09J123/16C09J123/22C09J7/00
Inventor 金俊镐李相泌孔利盛朴淳天卢正涉崔昌烜
Owner INNOX ADVANCED MATERIALS CO LTD
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