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High-frequency resin composition and application

A resin composition and a technology for the composition, which are applied to high-frequency resin compositions and application fields, can solve the problems of low peeling strength of insulators, low bending strength, high energy consumption, etc.

Pending Publication Date: 2019-03-08
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a high-frequency resin composition and its application to solve the problems of low peel strength, high energy consumption and low bending strength of existing insulators for high-frequency signal transmission

Method used

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  • High-frequency resin composition and application
  • High-frequency resin composition and application
  • High-frequency resin composition and application

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Experimental program
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Embodiment 1

[0045] The embodiment of the present application provides a high-frequency resin composition. The raw materials for the preparation of the high-frequency resin composition include: 40 parts of unsaturated polyphenylene ether resin, 45 parts of styrene-butadiene resin, unsaturated polybutadiene resin 10 parts, 3 parts of bismaleimide and 1 part of initiator.

[0046] The structural formula of unsaturated polyphenylene ether resin is In the above formula, the structural formula of Z is The structural formula of -(-O-Y-)- is The structural formula of -(-O-X-O-)- is a and b are 1 respectively. Among them, R 4 is a hydrogen atom, R 5 is a halogen atom, R 6 is phenyl, R 7 is propane group, R 8 is a hydrogen atom, R 9 is a halogen atom, R 10 is phenyl, R 11 is methyl, R 12 is ethyl, R 13 is pentyl, R 14 is isopentyl, R 15 is a butyl group, B is an alkylene group with 10 carbon atoms, and n is 1.

[0047] The structural formula of bismaleimide is Among them, R 1...

Embodiment 2

[0050] The embodiment of the present application provides a high-frequency resin composition. The raw materials for the preparation of the high-frequency resin composition include: 80 parts of unsaturated polyphenylene ether resin, 80 parts of styrene-butadiene resin, unsaturated polybutadiene resin 50 parts, 40 parts of bismaleimide and 7 parts of initiator.

[0051] The structural formula of unsaturated polyphenylene ether resin is In the above formula, the structural formula of Z is The structural formula of -(-O-Y-)- is The structural formula of -(-O-X-O-)- is a and b are 2 respectively. Among them, A is an arylene group, m is 1, R 1 is a hydrogen atom, R 2 is methyl, R 3 For propyl. R 4 is a halogen atom, R 5 is phenyl, R 6 is a halogen atom, R 7 is phenyl, R 8 is a halogen atom, R 9 is a halogen atom, R 10 is phenyl, R 11 is phenyl, R 12 is ethyl, R 13 is pentyl, R 14 is isopentyl, R 15 For butyl, n is 0.

[0052] The structural formula of bismale...

Embodiment 3

[0055] The embodiment of the present application provides a high-frequency resin composition. The raw materials for the preparation of the high-frequency resin composition include: 60 parts of unsaturated polyphenylene ether resin, 55 parts of styrene-butadiene resin, unsaturated polybutadiene resin 25 parts, 15 parts of bismaleimide and 3 parts of initiator.

[0056] The structural formula of unsaturated polyphenylene ether resin is In the above formula, the structural formula of Z is The structural formula of -(-O-Y-)- is The structural formula of -(-O-X-O-)- is a is 15 and b is 30. Among them, A is an arylene group, m is 6, R 1 is a hydrogen atom, R 2 is methyl, R 3 For propyl. R 4 is a heptane atom, R 5 is phenyl, R 6 is a halogen atom, R 7 is phenyl, R 8 is a halogen atom, R 9 is a hydrogen atom, R 10 is phenyl, R 11 is phenyl, R 12 is ethyl, R 13 is methyl, R 14 is heptyl, R 15 For butyl, n is 0.

[0057] The structural formula of bismaleimide is ...

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Abstract

The invention provides a high-frequency resin composition and application. Preparation materials of the high-frequency resin composition comprise: unsaturated polyphenylene ether resin, styrene-butadiene resin, unsaturated polybutadiene resin, bismaleimide and an initiator. The high-frequency resin composition prepared according to the above materials has good comprehensive properties such as lowdielectric loss, low dielectric constant, high peel strength and high bending strength, and not only satisfies the transmission of high-frequency signals, but also meets property requirements for machining, mechanical supporting and the like of a plate made from the high-frequency resin composition.

Description

technical field [0001] The invention relates to the field of high-frequency technology, in particular to a high-frequency resin composition and its application. Background technique [0002] In recent years, with the development of higher performance and higher functionality of computers and networks, it is required that computers and the like be able to process large-capacity information and realize high-speed transmission of large-capacity information. In order to realize the processing and high-speed transmission of large-capacity information, the operating signal is gradually increased in frequency to form a high-frequency signal. In order to realize the transmission of high-frequency signals, a high-performance electrical insulating material suitable for high-frequency signal transmission characteristics is required. [0003] In a circuit for high-frequency signal transmission, the electrical signal transmission loss is represented by the sum of dielectric loss, conduc...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L9/06C08L47/00C08J5/24
CPCC08J5/24C08J2309/06C08J2371/12C08J2409/06C08J2447/00C08J2471/12
Inventor 殷卫峰吴成蛟张记明师剑英李莎
Owner SHAANXI SHENGYI TECH
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