Dielectric paste for YH21CT stainless steel thick-film circuits and preparation method thereof

A technology of YH21CT and dielectric paste, which is applied in the direction of circuits, electrical components, quartz/glass/glass enamel, etc., can solve the problems of inability to meet the thermal performance requirements of thick-film circuits, mismatching expansion coefficients, thick-film sintering and oxidation, etc., to achieve Fast heating speed, better bonding performance, uniform heating effect

Inactive Publication Date: 2019-03-08
浙江亮能机电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for some special thick-film circuits, the use of brittle ceramic materials as substrates cannot meet their basic requirements. The most important problem is that they are fragile during installation and use; although polymer material substrates do not have the problem of fragility during installation and use , but cannot meet the thermal performance requirements of thick film circuits
The excellent mechanical and physical properties of metal materials make it possible to be used as substrate materials, but this also brings problems such as the mismatch between the expansion coefficient and the commonly used slurry, and the occurrence of oxidation during thick film sintering.

Method used

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  • Dielectric paste for YH21CT stainless steel thick-film circuits and preparation method thereof
  • Dielectric paste for YH21CT stainless steel thick-film circuits and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0016] A dielectric paste for YH21CT stainless steel thick film circuit:

[0017] 1. Glass-ceramic formula: SiO 2 (22%), BaO (5%), Al 2 o 3 (14%), H 3 BO 3 (10%), ZrO 2 (5%), Co. 3 o 4 (4%), MgO (25%), CaO (15%).

[0018] 2. Glass melting method and process: 1500°C, heat preservation for 3 hours.

[0019] 3. Ball milling and particle size control: use a vibrating ball mill for coarse grinding, and then use a planetary ball mill or mixer for fine grinding until the maximum particle size does not exceed 3 microns.

[0020] 4. Organic binder formula and dissolution method and process: tributyl citrate (20%), 1.4-butyrolactone (5%), ethyl cellulose (5%), hydrogenated castor oil (1%), Lecithin (4%), Terpineol (65%). Solvent process After mixing the components prepared in proportion, they are kept in a high-temperature (85-95° C.) water bath for 6 hours.

[0021] 5. Slurry preparation process: put glass-ceramic powder and organic binder in proportion (91:9) into the conta...

Embodiment 2

[0026] A dielectric paste for YH21CT stainless steel thick film circuit:

[0027] 1. Glass-ceramic formula: SiO 2 (20%), Ba0 (6%), Al 2 o 3 (10%), H 3 BO 3 (11%), ZrO 2 (3%), Co. 3 o 4 (5%), MgO (28%), CaO (17%).

[0028] 2. Glass melting method and process: 1500°C, heat preservation for 3 hours.

[0029] 3. Ball milling and particle size control: use a vibrating ball mill for coarse grinding, and then use a planetary ball mill or mixer for fine grinding until the maximum particle size does not exceed 3 microns.

[0030] 4. Organic binder formula and dissolution method and process: tributyl citrate (19%), 1.4-butyrolactone (5%), ethyl cellulose (6.5%), hydrogenated castor oil (1%), Lecithin (4%), Terpineol (64.5%). Solvent process The components prepared in proportion are mixed and then kept in a high temperature (85° C. to 95° C.) water bath for 5 hours.

[0031] 5. Slurry preparation process: Put the glass-ceramic powder and organic binder in proportion (95:5) int...

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Abstract

The invention discloses dielectric paste for YH21CT stainless steel thick-film circuits and a preparation method thereof. The dielectric paste is characterized by comprising the following components in percentage by weight: 91-95% of SiO2-BaO-Al2O3-H3BO3 glass ceramic powder and 5-9% of an organic binder, wherein the SiO2-BaO-Al2O3-H3BO3 glass ceramic powder comprises the following raw materials in percentage by weight: 20-60% of SiO2, 2-20% of BaO, 10-40% of Al2O3, 2-20% of H2BO3, 2-15% of ZrO2, 2-10% of Co3O4, 20-50% of MgO and 10-30% of CaO; and the organic binder comprises the following raw materials in percentage by weight: 3-30% of tributyl citrate, 0.2-15% of 1.4-butyrolactone, 1-15% of ethyecellulose, 0.5-10% of hydrogenated castor oil, 0.5-10% of lecithin and 60-82% of terpilenol.The preparation method comprises the steps of: A, preparing the glass ceramic powder; B, preparing the organic binder; and C, preparing the dielectric paste.

Description

technical field [0001] The invention relates to a dielectric slurry for a thick film circuit, in particular to a dielectric slurry for a YH21CT stainless steel thick film circuit and a preparation method thereof. technical background [0002] Traditional substrate materials such as ceramic materials and polymer materials have good dielectric properties, and a series of electronic pastes matching them have already been commercialized. However, for some special thick-film circuits, the use of brittle ceramic materials as substrates cannot meet their basic requirements. The most important problem is that they are fragile during installation and use; although polymer material substrates do not have the problem of fragility during installation and use , but cannot meet the thermal performance requirements of thick film circuits. The excellent mechanical and physical properties of metal materials make it possible to be used as substrate materials, but this also brings problems su...

Claims

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Application Information

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IPC IPC(8): H01B3/08H01B19/00C03C10/14C03C8/24
Inventor 朱峙
Owner 浙江亮能机电科技有限公司
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